Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Abstract:

Samtec's SEAM and SEAF series feature pitch grids for maximum grounding and wiring flexibility.

SEAFP-RA features:

Smaller insertion/withdrawal force

Durable Edge Rate® terminals

High-density pin open terminal array

Crimp tail design

Rectangular type

SEAFP-20-01-S-08-RA-WT-GP is a 160-position, 1.27mm SEARAY™ High speed terminal open terminal array socket with right Angle crimp.

Basic parameters:

Series: SEAFP-RA

Connector type: High-density array, parent shape

Needle number: 160

Spacing: 0.050" (1.27mm)

Number of rows: 8

Installation type: Through hole, right Angle, press fitting

Features: plate guide, fixed welding tail

Contact surface treatment: gold plating

Contact surface treatment thickness: 30.0µin (0.76µm)

Overview:

Samtec's SEARAY open pin area array uses a 0.050"x 0.050" (1.27 mm x 1.27 mm) pitch grid for maximum ground and wiring flexibility. The open pin area design provides the flexibility to provide differential pairs, single-ended signals, and power simultaneously through the same 28+ Gbps interconnect. The system's stack height ranges from 7 mm to 40 mm and offers up to 560 Edge Rate® contacts. Samtec's Edge Rate contact system is designed for high-speed, high-cycle applications. The surface of the Edge Rate contacts is milled to create a smooth mating surface area, rather than stamped contacts fitted on the cut edge. This smooth mating surface reduces wear marks on the contacts and increases the durability and cycle life of the contact system. It also reduces the insertion and withdrawal force.

In-line or right-angle arrays (SEAM/SEAF series) are available for 50 or 100Ω solutions. High hold crimped tail (SEAMP/SEAFP series) provides greater system flexibility.