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High-density MET008402413011 (Amphenol) Mini Cool Edge 0.60mm connector

High-density MET008402413011 (Amphenol) Mini Cool Edge 0.60mm connector

Source:our siteTime:2024-09-26Views:

The Mini Cool Edge is a 0.60 mm high-density, high-speed card edge connector for next-generation small form factor systems.

MET008402413011 is a Mini Cool Edge 0.6mm connector, EDSFF compliant, with 84 signal pins.


Overview:

The Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for the next generation of small systems. This fine-pitch solution supports a variety of board-to-board applications, such as right-angles, sandwich/coplanar, and offers cable interconnect options. These connectors comply with SFF-TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications. Common applications include solid-state drives, network interface cards, and plug-in cards. Available in vertical, right Angle, straddle and orthogonal options. High-speed performance up to 32 GT/s (or 56 GT/s PAM4).


Specifications of MET008402413011:

Number of positions: 84 positions

Installation style: Edge Mount

Installation Angle: Right Angle

Terminal type: Press Fit

Contact material: Copper Alloy

Contact plating: Tin

Trademark: Amphenol FCI

Cable type: Gen 5/6

Current rating: 1.1A

Height: 51.05mm

Shell material: Thermoplastic (TP)

Insulation resistance: 1 GOhms

Operating temperature: -40°C to +107°C

Number of rows: 2 rows


Features and Benefits:

For power applications, the signal pitch is 0.60 mm, the rated current is 1.1A, and up to 12 pins are supported

Suitable for low power board to board applications

Can supply power to module card

Signal pin options include 56, 84, 140, 168, and 280 pins

The number of pins can be customized on demand

Support a variety of board-to-board connection and FPGA, SSD, NIC and other module applications

Miniaturized design

Compact connector

Separate pin design

Single-ended high-speed differential pairs up to 32G NRZ, 56G PAM4, 112G PAM4 are supported

Support 1.6mm thick adapter plate

Suitable for most standard board-to-board applications


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