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Supply & Demand Amphenol (CBL280011A) EDSFF E3 2C Hybrid Cross Crimp PCIe ® Gen6 Cable Connectors

Supply & Demand Amphenol (CBL280011A) EDSFF E3 2C Hybrid Cross Crimp PCIe ® Gen6 Cable Connectors

Source:our siteTime:2024-09-14Views:

Amphenols Cool Express Link&trade is the EDSFF E3 2C hybrid orthogonal crimp product line. PCIe Gen 5/6 cable connectors support low latency, high bandwidth, and high throughput data transfers for existing and next-generation storage and CXL 3.1 a…

Amphenol's Cool Express Link&trade is the EDSFF E3 2C hybrid orthogonal crimp product line. PCIe® Gen 5/6 cable connectors support low latency, high bandwidth, and high throughput data transfers for existing and next-generation storage and CXL 3.1 applications. The die-cast housing design is robust and also provides a more stable connected environment through orthogonal design, designed for high-performance computing applications in artificial intelligence and machine learning that require advanced enterprise-class storage and a coherent memory sharing environment. The hybrid connector design simplifies the midboard design for efficient transmission of high-speed signals to the host end. User-friendly lock and snap design further improves usability. In addition, the system can be upgraded to E3 4C to meet future application requirements.

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Product: CBL280011A

Type: Cable connector

Needle number: 80 position

Number of rows: 2

Length: 500mm

Height: 51.05mm

Operating temperature: -40 °C to + 107°C


Applications:

• Artificial Intelligence and Machine Learning (AI/ML)

• High Performance Computing (HPC)


Features and advantages:

Rugged orthogonal die-cast housing

No external support is required

The hybrid design routes power and side strips to the center plate

Simplify the midboard architecture and reduce costs

Hybrid design for high-speed signal transmission to the host

Meet the low latency and low loss requirements of AI/machine learning and high performance computing

Easy locking and locking design

Cables are easy to plug and unplug

E3 2C design for current applications

Can be upgraded to E3 4C for future applications

Orthogonal high density design

Supports a set of hard disks/devices on the front panel

Separate connector and cable assembly design

Lower maintenance costs

Crimp connector design

No SMT component height restrictions


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