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Samsung Electronics today announced the start of mass production of its 12nm LPDDR5X DRAM (memory), the thinnest in the industry, supporting 12GB and 16GB capacities. This will further strengthen Samsung's position in the low-power memory market.

With extensive technical experience in the field of chip packaging, Samsung can provide ultra-thin LPDDR5X DRAM packaging to allow excess space in mobile devices and promote air flow. Heat dissipation control is thus enhanced, a property that is particularly critical for high-performance applications with complex functions such as end-to-end artificial intelligence.

YongCheol Bae, Executive Vice President, Memory Product Planning Team, Samsung Electronics, said:

LPDDR5X DRAM provides advanced thermal management capabilities in an ultra-thin package while delivering superior low-power performance on the mobile end, setting a new standard for high-performance end-to-end AI solutions. Samsung will continue to work closely with customers and continue to innovate to provide low-power DRAM solutions that meet the needs of The Times.

With the LPDDR5X DRAM packaging technology, Samsung offers its industry's thinnest 12-nanometer LPDDR DRAM with a four-layer stacked structure. Compared with the previous generation of products, the thickness is reduced by about 9%, and the heat resistance is improved by about 21.2%.

By using more advanced printed circuit board (PCB) and epoxy molding plastic (EMC) processes, the new generation of LPDDR DRAM has a package thickness of just 0.65 mm (mm), which is as thin as a fingernail, exceeding all previous LPDDR DRAM with a capacity of 12GB and above. In addition, Samsung has optimized the back grinding process to further compress the package thickness.

Samsung plans to continue expanding the low-power DRAM market by supplying 0.65mm LPDDR5X DRAM chips to mobile processor manufacturers and mobile device manufacturers. As the market demand for high-performance, high-density mobile storage solutions with smaller package sizes continues to grow, Samsung plans to develop 6-layer 24GB and 8-layer 32GB modules to create ultra-thin LPDDR DRAM packages for future devices.

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