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Description:

BGM13S22F512GA-V3 is a SIP module built around EFR32BG13 Series 1 SoC for Bluetooth 5 LE and Bluetooth mesh networking, with strong RF performance and low energy consumption, and has been certified for regulatory compliance. It also offers a variety of MCU peripherals and a simplified development experience, all in a compact size of 6.5 x 6.5 x 1.4.

The BGM13S22F512GA minimizes the engineering work and development costs associated with adding Bluetooth connectivity to any design, helping to accelerate time to market for products for wearables, iot end-node devices and gateways, sports and health, home and building automation, beacons, industrial automation, and other end-use applications.

Specifications

Product Category: Bluetooth module - 802.15.1

Series: BGM13S

Protocol: Bluetooth 5.0

Class: Bluetooth Low Energy (BLE)

Interface type: I2C, UART

Output power: 8 dBm

Data rate: 2 Mb/s

Receiver sensitivity: -90.2 dBm

Frequency: 2.44GHz

Supply voltage - Minimum: 1.8V

Power supply voltage - Max: 3.8V

Minimum operating temperature: -40 °C

Maximum operating temperature: + 85°C

Antenna: Chip

Core: ARM Cortex M4

Dimensions: 6.5mm x 6.5mm x 1.4mm

Frequency range: 2.4GHz to 2.4835GHz

Height: 1.4mm

Length: 6.5mm

Storage capacity: 64 kB, 512 kB

Modulation: GFSK

Modulation technology: GFSK

Humidity sensitivity: Yes

Installation style: SMD/SMT

Working power supply voltage: 1.8V to 3.8V

Protocols - Bluetooth, BLE - 802.15.1: Bluetooth, BLE

Sensitivity: -90.2 dBm

Receiving power supply current: 9.7mA

Transmission supply current: 8.9mA

Type: USB Adapter

Width: 6.5mm

Unit weight: 3.372g

Applications

Iot end devices and gateways

Wearable device

Health, sports and fitness equipment

Industrial, home and building automation

Accessories for smartphones, tablets and PCS

beacon

The company only recovers regular channel sources, such as agents, traders, terminal factories, etc., and does not accept non-regular channel sources.