Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Mingjiada Electronics offers immediate availability of the Xilinx XCZU5CG-1FBVB900I, a high-performance heterogeneous computing chip. Integrating multi-core processors and programmable logic, it addresses complex application scenarios.

XCZU5CG-1FBVB900I Summary

The XCZU5CG-1FBVB900I is a high-performance system-on-chip (SoC) within Xilinx's Zynq® UltraScale+™ MPSoC series. It uniquely integrates multi-core ARM processors with programmable FPGA logic onto a single chip, creating a powerful heterogeneous computing platform designed to provide core processing power for fields demanding high computational capability and flexibility, such as artificial intelligence, 5G communications, industrial automation, and automotive electronics.

Shenzhen Mingjiada Electronics Co., Ltd., as a globally leading distributor of electronic components, now stocks this chip in stock, ensuring genuine originals, and provides product consultation and procurement services to customers.

XCZU5CG-1FBVB900I Features

High-Performance Processor: Dual-core ARM® Cortex®-A53 processors supporting 64-bit architecture, operating at up to 1.2GHz, suitable for running complex operating systems such as Linux or real-time operating systems.

Real-time Control: Dual-core ARM® Cortex™-R5 processor operating at up to 600MHz, suitable for real-time control and high-reliability applications.

Extensive Memory Interfaces: Supports LPDDR4 memory at speeds up to 3200Mbps.

Robust FPGA Resources: 256K+ logic cells provide powerful programmable logic resources for graphics, video, waveform, and packet processing.

Multiple peripheral interfaces: Including CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, and more.

Operating temperature range: -40°C to 100°C (T_J), suitable for diverse industrial and automotive environments.

Package type: 900-FCBGA (31x31), ideal for high-density designs.

Specifications

Manufacturer: Xilinx Inc.

Device Model: XCZU5CG-1FBVB900I

Product Family: Zynq® UltraScale+™ MPSoC CG

Architecture: MCU, FPGA

Core Processor: - Dual-core ARM® Cortex®-A53 MPCore™ (with CoreSight™)

- Dual-core ARM® Cortex®-R5 (with CoreSight™)

Logic Units: 256,200

RAM Size: 256KB

Speed/Clock Frequency: Cortex-A53: up to 1.5GHz, Cortex-R5: up to 600MHz

Peripherals: DMA, WDT

Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

I/O Count: 204

Operating Temperature: -40°C to 100°C (TJ)

Package/Housing: 900-BBGA, FCBGA

Supplier Device Package: 900-FCBGA (31x31)

Mounting Style: SMD/SMT

Contact details:

Contact person: Mr Chen

Telephone: +86 13410018555

Email: sales@hkmjd.com

Company website: www.hkmjd.com