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Shenzhen Mingjiada Electronics Co., Ltd. supplies the Qualcomm QCC-3044-0-CSP90B-TR-01-0 Bluetooth audio chip.

1. Product Overview

The Qualcomm QCC-3044-0-CSP90B-TR-01-0 is a Bluetooth 5.2 audio system-on-chip (SoC) specifically designed for Bluetooth stereo headphones and portable speakers, aiming to deliver high-quality audio performance and low-power solutions.

2. Product Features

Audio Codec: Supports aptX™, aptX HD, and aptX Adaptive audio codecs, providing high-quality, low-latency, and stable audio transmission.

Bluetooth Version: Supports Bluetooth 5.2, offering faster pairing speeds and enhanced connection stability.

Audio Processing: Integrated with dual-core Qualcomm Kalimba DSP cores for audio processing and energy-efficient operations, while supporting Qualcomm TrueWireless Mirroring technology to ensure both earbuds maintain a mirrored connection with the audio source.

Noise Cancellation: Supports Qualcomm Clear Voice Capture (CVC) technology to effectively reduce environmental noise and enhance voice call quality.

Active Noise Cancellation: Supports feedforward, feedback, and hybrid active noise cancellation (ANC) technology to provide users with a high-fidelity audio experience.

Storage and Power Consumption: Features a 32Mbit FLASH memory for application startup and device customisation, along with an ultra-low power consumption architecture to optimise battery life in small devices.

Package Type: Uses BGA packaging, compact in size, suitable for small-sized, lightweight wireless audio devices.

3. Product Advantages

High-Performance Audio Experience: Supports multiple advanced audio codecs and noise cancellation technologies to provide users with convenient, high-quality audio experiences.

Low-Power Design: Specifically designed for low-power applications, helping to extend battery life and suitable for portable devices.

Stable Connection: Bluetooth 5.2 technology and Qualcomm TrueWireless Mirroring technology ensure stable connections and seamless switching between devices.

High Integration: Integrates multiple functions and components, reducing the number of external components and lowering system complexity and costs.

High Development Efficiency: Provides manufacturers with complete development tools and resources to help accelerate time-to-market.

4. Product Applications

The Qualcomm QCC-3044-0-CSP90B-TR-01-0 Bluetooth audio chip is widely used in Bluetooth headphones, Bluetooth speakers, and other portable audio devices, delivering high-quality wireless audio experiences to consumers.

5. Contact Information

Contact Person: Mr. Chen  

Phone: +86 13410018555  

Email: sales@hkmjd.com

Homepage: www.hkmjd.com