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According to the latest reports, South Korean media outlet kedglobal published a blog post yesterday (June 10) stating that Micron has surpassed Samsung and SK Hynix to become the first supplier of NVIDIA's next-generation memory solution, SOCAMM.

SOCAMM stands for Small Outline Compression Attached Memory Module, which is a more compact version of the CAMM compressed attached memory module. The current SOCAMM is based on LPDDR5X DRAM chips.

Similar to the previous LPCAMM2, SOCAMM currently features a single-sided design with four die pads and three fixed screw holes. However, unlike LPCAMM2, SOCAMM lacks the protruding trapezoidal structure on top, reducing overall height and making it more suitable for server installation environments and liquid cooling.

The SOCAMM has dimensions of 90mm × 14mm and uses a 128-bit bus width. The product demonstrated by Micron is based on four 16-core stacked 16Gb DRAM chips, achieving a total capacity of 128GB and supporting 8533 MT/s.

NVIDIA commissioned Samsung, SK Hynix, and Micron, three memory giants, to develop SOCAMM prototypes, but Micron was the first to pass certification. According to industry insiders, Micron's LPDDR5X chips are 20% more energy-efficient than competitors, which was a key factor in NVIDIA's selection.

Micron's innovations in thermal management stem from its focus on architectural design rather than relying solely on extreme ultraviolet lithography (EUV) technology to enhance density and yield.

Micron is consolidating its position through large-scale investments. This year, the company has committed to investing $14 billion in capital expenditures, including the construction of new HBM factories in Singapore, Japan, and New York State. An industry executive noted that this aggressive investment suggests Micron may have already signed long-term supply contracts with major hyperscale customers.

Future Outlook

Micron plans to launch HBM4, which will offer over 50% performance improvement over HBM3E, further solidifying its leadership in the AI memory market. As AI computing power demand surges, SOCAMM and HBM3E will become core components for data centres, autonomous driving, and edge AI, and Micron's first-mover advantage will give it a competitive edge.

This collaboration marks a new phase in AI storage technology, with Micron and NVIDIA joining forces to drive the development of next-generation high-performance computing.