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STMicroelectronics (ST) recently announced that its Wi-Fi 6 and low-power Bluetooth 5.4 dual-in-one wireless module ST67W611M1, jointly developed with Qualcomm, has officially entered the mass production stage. As the first product of the strategic cooperation between the two sides in 2024, this module will significantly lower the threshold for developing application systems based on the STM32 microcontroller (MCU), providing a one-stop wireless connection solution for the industrial Internet of Things, smart home and consumer electronics fields.

Strong Alliance: The deep integration of the STM32 ecosystem and Qualcomm Wireless technology

The ST67W611M1 module integrates Qualcomm's QCC743 multi-protocol Connectivity system-on-chip (SoC), supporting Wi-Fi 6, low-power Bluetooth 5.4 and Thread protocol, and is compatible with future OTA upgrades of the Matter protocol. The module is equipped with a complete RF front-end circuit (including power amplifier, low-noise amplifier, RF switch and balanced - unbalanced converter), and is also equipped with 4MB code and data flash memory, 40MHz crystal oscillator and integrated PCB antenna. Users can also choose to connect an external uFL antenna to optimize signal coverage.

This module seamlessly integrates Qualcomm's wireless connectivity technology into the STM32 ecosystem, enabling developers to achieve high-performance wireless functions without the need for RF design expertise. Remi El-Ouazzane, president of the Microcontroller, Digital IC and RF Products Division of STMicroelectronics, said, "With pre-certified hardware design, customers can shorten the development cycle by 40% and reduce costs by 30%."

Technological breakthrough: High integration and low power consumption design

The ST67W611M1 adopts a 32-pin LGA package, with a size of only 12.28mm×17.28mm. It supports a dual-layer PCB design, significantly reducing hardware complexity. Its core performance indicators include:

Wi-Fi 6 performance: Supports 1x1 2.4GHz frequency band, TCP throughput up to 18Mbps, maximum transmission power +21dBm;

Bluetooth 5.4 performance: Transmission power +10 DBM, receiving sensitivity -99 DBM (1Mbps rate);

Security Certification: Built-in hardware encryption accelerator, passed PSA Level 1 security certification, meeting the requirements of the EU RED Directive and the Cybersecurity Resilience Act;

Low power consumption feature: Supports multiple sleep modes, standby power consumption is less than 10mW, suitable for battery-powered devices.

Application scenarios: Covering all scenarios of consumer and industrial Internet of Things

This module can be seamlessly integrated with the entire series of STM32 MCUS and supports flexible combinations ranging from low-cost Cortex-M0+ devices to high-performance Cortex-M7/A7 MPUs. Typical applications include:

Smart home: Smart door locks, thermostats, lighting systems, etc., achieve cross-brand device interconnection through the Matter protocol;

Industrial Internet of Things: Predictive maintenance sensors, asset tracking devices, and low-power Mesh networks constructed using the Thread protocol;

Medical and health care: Wearable devices and remote monitoring terminals, relying on Bluetooth 5.4 to achieve long-distance stable connection.

Sylvain Bernard, the founder of Siana Systems, a provider of Internet of Things solutions, commented: "The ST67W611M1 enables our development team to complete wireless function integration within two weeks without the need for additional RF engineers, reducing the time to market for products by 60%."

Ecological empowerment: Development tools and Supply chain support

To accelerate the launch of customers' products, STMicroelectronics has simultaneously introduced the X-NUCLEO-67W61M1 expansion board and the STDES-ST67W61BU-U5 reference design, providing:

Development kit compatible with STM32Cube: Supports STM32CubeMX graphical configuration tool and HAL library, reducing the difficulty of code transplantation;

Pre-certified hardware design: The module has passed global certifications such as FCC and CE, allowing customers to directly integrate it into end products.

Flexible procurement mode: The minimum order quantity for modules is 10,000 pieces, with a unit price of 6.66 US dollars (approximately 47.8 RMB), and the minimum order quantity for expansion boards is 100 pieces, with a unit price of 39 US dollars.

Market prospects: Reshaping the competitive landscape of Internet of Things (iot) connectivity

According to ABI Research's prediction, the number of global Internet of Things (iot) device installations will exceed 80 billion by 2028, among which the compound growth rate of Wi-Fi 6 and low-power Bluetooth will reach 25%. The collaboration between STMicroelectronics and Qualcomm directly challenges the market position of traditional discrete solutions through a heterogeneous integration model of "MCU+ wireless SoC".

The mass production of ST67W611M1 marks the entry of Internet of Things connection technology into the "plug and play" era. Rahul Patel, general manager of Qualcomm's Connectivity, Broadband and Networking business unit, said, "In the future, the two sides will expand to broader wireless protocols such as 5G RedCap and UWB to promote the deep integration of edge AI and real-time communication."

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