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Texas Instruments has introduced a global ultra-small MCU, further expanding its full portfolio of Arm Cortex-M0+ MSPM0 MCUS. The MSPM0C1104 MCU is in a wafer-on-chip package (WCSP) measuring just 1.38mm2, or about the size of a black peppercorn-allowing designers to optimize the layout space for compact applications such as medical wearables and personal electronics without compromising performance.

"In ultra-small systems such as earplugs and medical probes, board space is a scarce and valuable resource," said Vinay Agarwal, vice president and general manager of MSP microcontrollers at Texas Instruments. "Thanks to this global ultra-small MCU, our MSPM0 MCU portfolio opens up endless possibilities to make our everyday experiences smarter and more connected."

Texas Instruments' MSPM0 MCU portfolio includes more than 100 cost-effective MCUS that offer scalable on-chip analog peripherals configurations and a variety of computing options to enhance sensing and control for embedded designs. This series of devices has been presented at the grand International Embedded Exhibition held in Nuremberg, Germany.

Ultra-small package, unlimited possibilities

Consumers continue to demand that everyday electronic devices, such as electric toothbrushes and stylus pens, not only be smaller and less expensive, but also have more functions. To innovate in reducing product size, engineers increasingly need to use small integrated components to increase functionality while maintaining space on the board. The MSPM0C1104 MCU takes full advantage of WCSP packaging technology, and through careful feature selection and cost optimization of Texas Instruments, its 8-ball WCSP size is only 1.38mm2, which is 38% smaller than comparable products.

The MCU is equipped with 16KB of memory, a 12-bit three-channel analog-to-digital converter, and 6 universal input/output pins. It is compatible with standard communication interfaces such as universal asynchronous transceivers (UART), serial peripheral interfaces (SPI), and internal integrated circuits (I2C). This global ultra-small MCU integrates precise high-speed analog components, enabling engineers to maintain the computing performance of embedded systems without increasing the size of the board.

To learn more about how this product optimizes packaging technology and functional integration, please read the technical article.

Cover design needs from small to large using the same MCU product family

Texas Instruments added the new MSPM0C1104 to its MSPM0 MCU portfolio, which combines scalability, cost optimization and ease of use to reduce time to market. Texas Instruments' MSPM0 MCUS offer pin-to-pin compatible package options and feature set to meet the memory, analog and compute power needs of personal electronics, industrial and automotive applications. In addition, the portfolio offers a variety of small package options to help optimize fabric size and streamline the bill of materials. With this optimization and functional integration, engineers have the flexibility to design products of various sizes while reducing system cost and complexity.

Further support is provided by Texas Instruments' comprehensive ecosystem, which includes software development kits optimized for all MSPM0 MCUS, hardware development kits for rapid prototyping, reference designs, and subsystems that serve as examples of common MCU functional code. With Zero Code Studio tools from Texas Instruments, users can configure, develop and run MCU applications in just minutes without writing any code. Engineers can leverage this ecosystem to scale design and reuse code without making major changes to hardware or software. In addition to this ecosystem, Texas Instruments continues to invest in increasing in-house manufacturing capabilities to meet future demand, which also supports the MSPM0 MCU portfolio.

Packaging, availability

The MSPM0C1104 MCU is available for pre-order on TI.com.

• Multiple payment and shipping methods are supported.

• The MSPM0C1104 LaunchPad™ development kit is now available on TI.com.

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