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Supply Samtec High Density Array Connectors:NovaRay,AcceleRate HD,AcceleRate MP,SEARAY™ 0.80 mm

Shenzhen Mingjiada Electronics Co., Ltd. is a professional company engaged in the supply of electronic components, the main products include integrated circuits, 5G chips, new energy ICs, Internet of Things ICs, Bluetooth ICs, Telematics ICs, automotive ICs, automotive grade ICs, communication ICs, artificial intelligence ICs, etc. In addition to the supply of memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips WiFi chips, wireless communication modules, connectors, etc. The company is committed to providing global customers with high quality electronic components and solutions, which are widely used in communication, consumer electronics, industrial control, automotive electronics and other fields.

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

NovaRay Series

NovaRay® combines extreme density and performance for 128 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features

128 Gbps PAM4 per channel

PCIe® 7.0 capable

4.0 Tbps aggregate data rate - 9 IEEE 400G channels

Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control

Two points of contact ensure a more reliable connection

92 Ω solution addresses both 85 Ω and 100 Ω applications

Analog Over Array™ capable

Product：NVAM，NVAF，GPSO，NVAC，NVAM-CT，NVBF，NVB M-RA，NVCF，NVCM-RA

AcceleRate HD Series

These 0.635 mm pitch high-density, open-pin-field arrays feature up to 400 high-speed Edge Rate® contacts in a slim, low-profile design.

Features

Incredibly dense with up to 400 total I/Os

Low profile 5 mm to 16 mm stack heights

Slim 5 mm width

4-row design; 10 - 100 positions per row

Edge Rate® contact system optimized for signal integrity performance

Open-pin-field design for grounding and routing flexibility

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.2 capable

Right-angle and cable in development

SureWare™ ultra rugged guide post standoffs available (GPSO)

Product：ADM6，ADF6，CPSO

AcceleRate MP Series

These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).

Features

Best in class density for power and signal

Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.2 capable

Open-pin-field design for grounding and routing flexibility

High-density multi-row design

Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap

4 or 8 total power blades; up to 10 in development

60 or 240 total signal positions; additional position counts in development

0.635 mm signal pitch

Optional alignment pins

Standard weld tabs for a secure connection to the board

Polarized guide posts for blind mating

Product：UDM6，UDF6

SEARAY™ 0.80 mm Series

These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.

Features

0.80 mm (.0315") pitch grid

50% board space savings versus .050" (1.27 mm) pitch arrays

28 Gbps NRZ/56 Gbps PAM4 performance

Rugged Edge Rate® contact system

Up to 500 I/Os

7 mm and 10 mm stack heights

Solder charge terminations for ease of processing

Final Inch® certified for Break Out Region trace routing recommendations

Analog Over Array™ capable

Product：SEAM8，SEAF8，SEAF8-RA，JSO，GPSK，GPPK