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Recycle Samtec Backplane Connectors:ExaMAX Series,XCede HD Series,NovaRay Series

Shenzhen Mingjiada Electronics Co., Ltd. is a company that focuses on electronic components recycling, sales and inventory disposal. Below are the company's detailed information on electronic components recycling:

1. Recycling scope

Electronic components: including integrated circuits (ICs), diodes, transistors, connectors, sensors, microcontrollers, 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, Telematics ICs, automotive ICs, automotive-grade ICs, telecommunication ICs, AI ICs and so on.

Inventory disposal: Recycle the backlog of electronic components inventory of factories, individuals and agents.

2. Recycling process

Consultation and quotation: Customers provide information such as component model, quantity, brand, etc., and the company provides quotation after evaluation.

Detection and evaluation: After receiving the components, we will carry out professional testing to ensure that the quality and model are correct.

Payment and Settlement: After confirming the correctness, payment will be made according to the agreed method, and a variety of settlement methods will be supported.

3. Service Advantages

Professional team: We have an experienced technical team to ensure that the recycling process is efficient and accurate.

Reasonable price: Provide competitive offer according to market conditions.

Confidentiality agreement: Strictly protect customer information to ensure transaction security.

High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.

NovaRay® micro rugged backplane system enables performance to 112 Gbps PAM4 with an offset footprint and provides configurable signal banks for design flexibility.

ExaMAX Series

The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).

Features

Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch

PCIe® 6.0/CXL® 3.2 capable

Allows designers to optimize density or minimize board layer count

Two reliable points of contact, even when subjected to angled mating

Meets Telcordia GR-1217 CORE specification

Individual signal wafers with staggered differential pair design; 24–72 pairs (board connectors) and 16–96 pairs (cable assemblies)

One-piece embossed ground structure on each signal wafer to reduce crosstalk

Lowest mating force on the market: 0.36 N max per contact

Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates

Samtec's Eye Speed® ultra low skew twinax cable provides increased flexibility and routability

Stub free mating

Press-fit termination

Power and Guide Modules available

ExaMAX Product：EBTM，EBTM-RA，EBTF-RA，EBDM-RA，EBCM，EBCF，EGBM，EGBF，EPTT，EPTS，EBCL，EBCB

XCede HD Series

Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.

Features

Small form factor provides significant space savings

Modular design provides flexibility in applications

High-density backplane system – up to 84 differential pairs per linear inch

1.80 mm column pitch

3-, 4- and 6-pair designs

4, 6 or 8 columns

12–48 pairs

Up to a 3.00 mm contact wipe on signal pins

Multiple signal/ground pin staging options

Integrated power, guidance, keying and side walls available

85 Ω and 100 Ω options

Three levels of sequencing enable hot plugging

Cost-effective designs available for low-speed applications

Power modules (HPTT/HPTS) are available as a standalone power solution with 10 Amps max per blade

XCede HD Product：HDTF，HDTM，BSP，HPTS，HPTT

NovaRay Series

NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 128 Gbps PAM4.

Features

Ultra-high density with up to 128 differential pairs in a single connector

128 Gbps PAM4 performance per channel

PCIe® 7.0 capable

Supports blind mate applications

Surface mount for better density and performance

Offset footprint for optimum signal integrity

Flyover® cable assembly in design

NovaRay Product：NVBF，NVB M-RA，NVCF，NVCM-RA