sales@hkmjd.com
Service Telephone:86-755-83294757
Qualcomm Bluetooth Chip QCC3071_QCC-3071-0-WLNSP99-TR-04-0 Bluetooth 5.3 Dual Mode
Shenzhen Mingjiada Electronics Co., Ltd. new and original launch Qualcomm Bluetooth 5.3 QCC3071_QCC-3071-0-WLNSP99-TR-04-0 Bluetooth wireless audio, the new LE Audio technology standard● Bluetooth chip: QCC3071● Bluetooth version: 5.3● Module size:…
Shenzhen Mingjiada Electronics Co., Ltd. new and original launch Qualcomm Bluetooth 5.3 QCC3071_QCC-3071-0-WLNSP99-TR-04-0 Bluetooth wireless audio, the new LE Audio technology standard
● Bluetooth chip: QCC3071
● Bluetooth version: 5.3
● Module size: 13mm x 20mm x 2.5mm
● Supply voltage: 3.0-4.3v
● Support I2S, SPDIF, analog audio interface, sample rate up to 24Bit/96Khz.
● Support USB, UART, I2C, IO and other interfaces
Apply to Bluetooth wireless radio audio, Bluetooth hearing aids, Bluetooth headset, Bluetooth earbuds, Bluetooth audio, Bluetooth wireless microphone, etc..
Qualcomm S3 audio platform, silkscreen model QCC3071. Qualcomm S3 audio platform supports Snapdragon Sound, optimized and dual Bluetooth mode, combining the traditional Bluetooth wireless audio, the new LE Audio technology standard, the full-link latency is as low as 55ms; and for the first time, it supports the aptX Lossless transmission to provide CD-level lossless sound quality.
Qualcomm S3 audio platform supports Bluetooth 5.3, dual Bluetooth mode, for audio sharing and broadcasting integrated LE Audio; supports multi-point Bluetooth wireless connection, can be seamlessly switched between the audio source devices; with the third generation of Qualcomm Adaptive Active Noise Cancellation technology, can be intelligently adapted to the wind noise processing, to prevent whistling, a variety of wearable fit, support for the natural transmissive mode, Qualcomm aptX Adptive audio.
Qualcomm S3 audio platform also supports three-microphone Qualcomm cVc echo cancellation, noise suppression (ECNS), aptX Voice audio, which can be activated by the wake word or button to activate the voice assistant, for real-world use cases, with ultra-low power consumption to achieve enhanced machine learning capabilities, and its compact wafer-level packaging SoC, which can greatly reduce the size of the device.
The company also acquired Bluetooth chip QCC3071_QCC-3071-0-WLNSP99-TR-04-0 Bluetooth audio SoC, Bluetooth 5.3, only original genuine, bulk new refurbished will not be considered, with the original packaging is preferred!
If you have any demand, please feel free to call Mr. Chen:
Tel:+86 13410018555
E-mail: sales@hkmjd.com
Home URL: www.hkmjd.com
Time:2024-11-19
Time:2024-11-19
Time:2024-11-19
Time:2024-11-19
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
CopyRight ©2022 Copyright belongs to Mingjiada Yue ICP Bei No. 05062024-12
Official QR Code
Links: