Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Shenzhen Mingjiada Electronics Co., LTD., as a leader in the field of electronic recycling, with its strong economic strength and good business reputation, quickly won the trust of many factory customers around the world, and established a long-term cooperative relationship.

SAMSUNG's HBM (High Bandwidth Storage) solutions have been optimized for High performance Computing (HPC), delivering the performance needed to support next-generation technologies such as artificial intelligence (AI) that will change the way we live, work and connect. The HBM products recovered by Mingarda Electronics mainly include the following:

1, HBM‌ : This is the earliest version, using 3D stacking technology, multiple DRAM chips stacked vertically together, through the silicon hole (TSV) technology to achieve high-speed signal transmission between the chips.

2. HBM2‌ : The data transmission rate of HBM2 has been increased from 1Gbps-1.6Gbps per pin to 2Gbps-3.2Gbps, and the total bandwidth has been greatly increased, which can reach hundreds of GB per second.

3. HBM2E: HBM2e excels in high-performance computing and graphics processing, providing higher storage capacity and lower power consumption ‌.

4, HBM3‌ : HBM3 bandwidth up to 819GB/s, processing speed up to 6.4Gbps. The HBM3 Icebolt is stacked with 12 layers of 10nm 16 Gb DRAM die and has a storage capacity of 24GB, increasing energy efficiency by 10% compared to the previous generation ‌.

5, HBM3E: This is an extended version of HBM3, providing higher stack layers and bandwidth. The HBM3E is available in 8hi and 12hi specifications, which further improves the data throughput of the memory system ‌.

6. HBM4‌ : The logic chip with 4nm process and the DRAM with 10nm process are adopted. HBM4 supports 2048bit interfaces and a data transfer rate of 6.4GT/s, and a single stack bandwidth of 1.6TB/s, greatly improving the data throughput capacity of the memory system, and is suitable for artificial intelligence, deep learning, big data processing, and high performance computing and other fields ‌.

Recovery process

1, you will be the backlog of IC/ module inventory for simple classification, determine the model, brand, production date, quantity, etc.

2. Please send the inventory list to our evaluation team by fax or email.

3. Wait for the procurement quotation from the company's professionals, and after reaching an agreement, both parties will discuss the specific transaction method for delivery.

4, the company only recovers regular channel sources, such as agents, traders, terminal factories, etc., do not accept non-regular channel sources.

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