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Recycle Lattice FPGA:iCE40 UltraPlus,iCE40 Ultra / Ultra Lite,iCE40 LP/HX

As a professional recycler of electronic components, Shenzhen Mingjiada Electronics Co., Ltd., we are committed to digesting inventory, reducing warehousing, and lowering customers' warehousing costs and management costs.

Long-term recycling of 5G chips, new energy IC, IOT IC, Bluetooth IC, Telematics IC, automotive IC, automotive grade IC, communication IC, artificial intelligence IC, memory IC, sensor IC, microcontroller IC, transceiver IC, Ethernet IC, WiFi chip, wireless communication module, connector, etc.

iCE40 UltraPlus——ML/AI Low Power FPGA

Low Power Connectivity and Computing – With the rising complexity of systems used to power smart homes, factories and cities, the iCE40 UltraPlus FPGA can solve connectivity issues with a wide variety of interfaces and protocols and provide the low power computational resources for higher levels of intelligence.

Edge Intelligent FPGA – The iCE40 UltraPlus FPGA with 5k lookup tables (LUTs) is able to implement Neural Networks for pattern matching necessary to bring always-on intelligence to the edge. Optimized for best-in-class power, designers can eliminate latency associated with cloud intelligence while keeping the overall system solution cost low.

Flexible Package Options – Multiple package are available to fit a wide range of applications needs. From an ultra-small 2.15 x 2.50 mm WLCSP package optimized for consumer and IoT devices, to a 0.5 mm pitch 7 x 7 mm QFN for cost optimized applications.

Features

Flexible logic architecture with 2800 or 5280 4 input LUTs, customizable I/O, up to 80 kbits of embedded dual port memory and 1 Mbit of embedded single port memory

Ultra-low power advanced process with static current as low as 75 uA and 1-10 mA active current for most applications

High performance signal processing using DSP blocks with multiply and accumulate functions

Soft Neural Network IPs and compiler for flexible Machine Learning/AI implementation

FPGA design tools, demos and reference designs to kick start designs

iCE40 Ultra / Ultra Lite——Industry-Leading Small Footprint, Low Power FPGA for High Volume Applications

World’s Most Popular Low Power FPGA – The iCE40 family has been designed into multiple generations of high-volume applications. Unlike traditional FPGAs, most designs run in the single digit mW power level.

Innovate and Take New Ideas to Market – Why wait to spin new silicon? Add functionality to products today using FPGA logic resources, integrated DSPs and embedded memory blocks at a cost similar to typical ASICs and SOCs.

Free Your Designs From Space Constraints – Ultra small 1.4 mm x 1.4 mm x 0.45 mm WLCSP package removes all barriers to innovation and customization. Available in advanced 0.35 mm pitch package.

Features

Flexible logic architecture with up to 3,520 4 input LUTs, up to 26 I/Os for customized interfaces and up to 80 Kbits of embedded distributed memory

Ultra-low power advanced process with sleep current as low as 35uA and 1-10 mA active current for most applications

High performance signal processing using DSP blocks with multiply and accumulate functions

Hardened SPI and I2C blocks to interface to variety of sensors and peripherals

FPGA design tools, demos and reference designs to kick start designs

iCE40 LP/HX——Low-Power, High-Performance FPGA with Small BGA package for the thinnest devices

Silicon Has Never Been More Flexible – Add new features to your mobile design and maximize product differentiation in an instant using up to 7680 programmable logic cells.

Power for the People – Designed from the ground up for low power starting at 25 µW, these iCE40 devices maximize battery life and minimize power consumption for ultra-low power, always-on applications.

High Functional Density for the Thinnest Devices - Squeezing so much functionality in such a small BGA package was no easy task. Measuring just 1.40 mm X 1.48 mm x 0.45 mm, iCE40 LP/HX devices can fit in the most space constrained modules.

Features

Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)

Integrated hard I2C and SPI cores that enable flexible device configuration through SPI

Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI

Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS

Up to 128 kbits sysMEM™ Embedded Block RAM

Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications