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To address memory yield, performance woes: Samsung designs new version of 1b nm DRAM from scratch
January 21 news, Korean media ETNews reported today that Samsung Electronics internal to cope with its 12nm DRAM memory products facing the yield and performance of the double predicament, has decided at the end of 2024 in the improvement of the exist…
January 21 news, Korean media ETNews reported today that Samsung Electronics internal to cope with its 12nm DRAM memory products facing the yield and performance of the double predicament, has decided at the end of 2024 in the improvement of the existing 1b nm process at the same time to design a new version of 1b nm DRAM from scratch.
The new 12nm DRAM process project, called D1B-P (note: P is short for Prime), is said to focus on improving energy efficiency and thermal performance, which is the same naming logic as Samsung's previous sixth-generation V-NAND improvement process, V6P.
▲ Samsung Electronics' 32Gb DDR5 based on existing 12nm-grade process
Samsung announced the completion of the development and mass production of its 12nm-class DDR5 DRAM in December 2022 and May 2023, but this generation of process has not been successful in key areas such as LPDDR5x, and Samsung's DS department has even lost its position as the initial memory supplier of the Galaxy S25 series of mobile phones in the MX department.
In addition, the yield of the existing 12nm DRAM process was only about 60% at the time the decision was made to launch the D1B-P project, which is far below the 80%-90% required for mass production in the industry.
According to the report, Samsung Electronics ordered the necessary equipment for the D1B-P project at the end of 2024, and the process is expected to be mass-produced in 2025, with the earliest launch date in the second to third quarter of this year.
Time:2025-01-22
Time:2025-01-22
Time:2025-01-22
Time:2025-01-22
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