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Shenzhen Mingjiada Electronics Co., Ltd. supplies single-chip audio platform QCC-3071-0-WLNSP99-TR-04-0 Extremely low power Bluetooth audio SoC optimised for compact, feature-rich, truly wireless earbuds.DescriptionThe QCC-3071-0-WLNSP99-TR-04-0 is de…
Shenzhen Mingjiada Electronics Co., Ltd. supplies single-chip audio platform QCC-3071-0-WLNSP99-TR-04-0 Extremely low power Bluetooth® audio SoC optimised for compact, feature-rich, truly wireless earbuds.
Description
The QCC-3071-0-WLNSP99-TR-04-0 is designed for the future of wireless sound, supporting LE audio use cases and lossless CD (16-bit 44.1kHz) audio with Snapdragon Sound™ technology - our optimised chain of superior audio, connectivity, and mobile innovation.
The Qualcomm® QCC307x SoC family is a family of flash-programmable Bluetooth audio system-on-chips (SoCs) based on an ultra-low-power architecture. Designed for the future of Bluetooth audio, they address listeners' needs for rugged, feature-rich, truly wireless earbuds that support 24/7 use. The family includes options to support the Bluetooth® LE audio standard and benefits from the Snapdragon Sound™ Technology Suite, our optimised chain of superior audio, connectivity and mobile innovations.
With our highly integrated Bluetooth technology, these SoCs deliver a superior, sophisticated user experience. The QCC307x supports legacy Bluetooth technology alongside LE audio use cases to deliver a superior listening experience in a variety of environments.
QCC30xx Block Diagram
Features
Ultra-low power performance
Designed to support Bluetooth LE audio use cases
Bluetooth 5.3 radio
Ultra-small form factor
Powerful triple-processor architecture - supports complex use cases
Dual-core 32-bit processor application subsystem (up to 80 MHz)
Single-core 240 Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (running from ROM)
Qualcomm TrueWireless™ mirroring technology for increased robustness and superior user experience
Designed to support wake word and/or button activated digital assistants, including Amazon Alexa voice service and Google Assistant
Supports Google Quick Pairing
Software architecture compatible with Qualcomm® QCC302x, Qualcomm® QCC304x, Qualcomm® QCC304x and Qualcomm® QCC305x families
Embedded ROM + RAM and external Q-SPI flash memory
Interface to external SRAM or second flash device
On-chip memory for audio buffering
High-performance audio combined with low power consumption
Supports aptX voice advanced features for improved call quality on uplink and downlink
Supports 24bit/96kHz high-resolution audio
Support for aptX audio, including aptX Adaptive
cVc
Supports Qualcomm Adaptive ANC - feed forward, feedback, hybrid and adaptive
Supply QCC-3071-0-WLNSP99-TR-04-0 Ultra-low power, single-chip audio platform optimised for use with all levels of truly wireless earbuds.
Time:2025-01-10
Time:2025-01-10
Time:2025-01-10
Time:2025-01-10
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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