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Samsung Electronics has launched pilot production of 4nm HBM4 logic chips, sources say

Samsung Electronics has launched pilot production of 4nm HBM4 logic chips, sources say

Source:our siteTime:2025-01-04Views:

On 3 January, the Korean media Chosun Biz reported today that Samsung Electronics DS Division Memory Business Unit recently completed the design of an HBM4 memory logic chip; the Foundry Business Unit has now launched trial production based on the des…

On 3 January, the Korean media Chosun Biz reported today that Samsung Electronics' DS Division Memory Business Unit recently completed the design of an HBM4 memory logic chip; the Foundry Business Unit has now launched trial production based on the design using a 4nm process.


After completing the final performance verification of the logic chip, Samsung Electronics will provide customers with samples of its developed HBM4 memory.

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In the HBM4 generation, due to a series of factors such as the doubling of the number of I/O pins in the memory stack and the need to integrate more functions, the three major memory manufacturers have adopted Logic Semiconductor to manufacture logic chips. In the HBM4 generation, due to a series of factors such as the doubling of the number of I/O pins in the memory stack and the need to integrate more functions, the three major memory manufacturers are using logic semiconductors to manufacture logic chips.


According to industry insiders, heat generation during operation is the biggest enemy of HBM memory, and the logic chip in the stack as a whole is a major heat generator, so the use of advanced processes to manufacture logic chips can help improve the energy efficiency and performance of HBM4.


Samsung Electronics is trying to take a relatively aggressive technology route in HBM4 to regain the market share of HBM memory that was lost in the HBM3 (E) generation due to quality reasons: in addition to adopting its own 4nm process to manufacture the logic chip, Samsung Electronics will introduce 1c nm process DRAM Die in HBM4 and is expected to introduce a bump-free hybrid bonding technology in the 16Hi stack.

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