Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Acquisitions Lattice Video Connection FPGA:CrossLinkU-NX,CrossLinkPlus

Shenzhen Mingjiada Electronics Co., Ltd. is an experienced electronic components recycler with a strong team, high-priced recycling of imported original ICs, acquisition of integrated circuits ICs, acquisition of sensors, acquisition of microcontrollers MCU, acquisition of Bluetooth chips, acquisition of Ethernet chips, acquisition of the factory's backlog of electronic materials, the acquisition of electronic components! 

Specific recycle process: 

1. You can simply classify your IC/module stocks and identify the model, brand, production date, quantity, etc. 

2. Please send your inventory list to our evaluation team by fax or e-mail. 

3. When you receive the purchase offer from one of our professionals, we can negotiate the specific transaction method and delivery and reach an agreement. 

4. We only recycle from regular channels, such as agents, traders, and factories, and do not accept irregular sources. 

CrossLink-NX

Embedded Vision and Processing FPGA

Built on the Lattice Nexus Platform - Up to 75% lower power vs similar FPGAs and small form factor packaging with sizes as small as 4 mm x 4 mm.

Provides Best-in-class Performance for Vision Processing Applications - Abundant DSP resources as well as high memory to logic cell ratio (up to 170 bits per logic cell) accelerates AI inferencing.

High Speed Interfaces - 2.5 Gbps Hardened MIPI D-PHY, 5 Gbps PCIe, 5 Gbps USB 3.2, 1.5 Gbps programmable I/O, 1066 Mbps DDR3. Supporting LVDS, subLVDS, OpenLDI (OLDI), and SGMII.

Low Power Standby Mode and USB Interface - Consumes < 70 uA of current under typical standby mode.

Features

Instant-on configuration – IO configures in 3 ms, and device as fast as 8 ms

Up to two hardened 4-lane MIPI D-PHY transceivers at 10 Gbps per PHY / 2.5 Gbps per lane

Up to 37 programmable source synchronous I/O pairs for camera and display interfacing

From 4 mm x 4 mm WLCS package (0.4 mm pitch) to 17 mm x 17 mm BGA package (0.8 mm pitch)

Lowest soft error rate in its class, 100X more reliable than competition

Available in Commercial, Industrial and Automotive (AEC-Q100 qualified) temperature grades

CrossLinkPlus

Low power MIPI bridging solution with integrated flash

Instant-on Delivers Seamless Visual Experience – Ready to connect to image sensors and displays in less than 10 ms from device boot up.

Small Footprint, Low Power, High Performance – Small 3.5 mm x 3.5 mm BGA footprint, less than 100 mW operating power for many use cases, and 6 Gbps MIPI D-PHY video bandwidth.

Simplify Development with IP and Reference Designs – Examples demonstrating the most popular applications: signal aggregation, duplication, and splitting.

Features

Instant-on (< 10 ms) configuration with integrated flash memory

Integrated flash enables flexible reprogramming in the field

Two 4-lane MIPI D-PHY transceivers at 6 Gbps per port

11 programmable, source synchronous I/O pairs for camera and display interfacing

Available in small 3.5 mm x 3.5 mm BGA package with 0.4 mm pitch

Comprehensive library of IP and reference designs, compatible with CrossLink