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December 27, according to media reports, TSMC will mass produce 2nm process next year, the semiconductor field is staging a new round of process competition.

Earlier there were rumours that TSMC will use its 2nm node to manufacture A19 series AP, but the latest supply chain news suggests that the A19 series chips will be manufactured using TSMC's third-generation 3nm process (N3P), which will be debuted by the iPhone 17 series.

Apple's 2026 launch of the iPhone 18 series will debut with TSMC's A20 series of APs manufactured in the 2nm process, and Apple will be the first customers of TSMC's 2nm process.

It is worth noting that the initial orders for TSMC's 2nm process are already lined up, and in addition to its largest customer, Apple, which has all but signed up for 2nm capacity in 2026, HPC (high-performance computing) makers, artificial intelligence (AI), chipmakers, and mobile chipmakers are all involved, with companies such as AMD, Nvidia, MediaTek, and Qualcomm hoping to get on board TSMC's 2nm fast boat.

According to a research report by Damo, TSMC's 2nm monthly production capacity will increase from this year's 10,000-piece pilot scale to about 50,000 next year, and by 2026, the A20 chip built into Apple's iPhone 18 will use a 2nm process, when the monthly production capacity will be 80,000 pieces, and the 3nm production capacity will be synchronised with the expansion to 140,000 pieces, of which the U.S. Arizona plant will have a production capacity of 20,000 pieces.

Industry analysts believe that, based on the manufacturer's public data, the new process 2nm process technology will be used GAA surround gate architecture, compared to the 3nm process, 2nm performance enhancement of up to 15%, or power consumption by 30%.

In addition, in view of the new process initial capacity yields low, high manufacturing costs, open capacity orders foundry costs will certainly soar, the relevant terminals do not rule out the possibility of continued price increases.