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With the rise of data-intensive technologies, the need for high-speed, high-reliability storage technologies is growing every day. At the same time, a series of new standards have been developed and introduced in countries around the globe to accommodate these infrastructure changes and data demands.

The Enterprise and Data Centre Standard Grade Packaging (EDSFF) E1/E3 series is a cutting-edge solution that revolutionises storage infrastructure.The EDSFF E1/E3 standard is designed to address the shortcomings of traditional storage packaging specifications through enhanced density, increased scalability and improved performance. The standard ensures compatibility with existing data centre architectures and ease of integration.

EDSFF has evolved through a series of iterations, and the E1 and E3 series have emerged from the competition as industry leaders. The E1 Series in particular is noted for its compact design and outstanding performance, while the E3 Series builds on the E1 Series with optimised performance and functionality, focusing on optimising scalability and performance to meet the changing needs of the data centre and paving the way for future innovations in storage technology.

A particularly compelling feature of the EDSFF E1/E3 series is its high-speed performance. Supporting next-generation PCIe ® and NVMe interfaces, these solutions deliver ultra-high data transfer rates while reducing latency and improving overall system responsiveness. Whether for high-performance computing, artificial intelligence or enterprise storage applications, the EDSFF E1/E3 series can provide unrivalled high-speed transfers. In addition, the EDSFF E1/E3 series is optimised for scalability and density.

The E1 series is available in both L-type and S-type packages; the E1.L version, often referred to as the ‘Straight Ruler’, has a longer form factor and takes up more space in the server. The E1.S version comes in a smaller package than the E1.L version, but is more rugged. By taking advantage of the small package and optimising the internal arrangement, this series of solutions is designed to be extremely compact, while being able to increase storage capacity. This enables the deployment of more high-capacity storage within the data centre without taking up additional rack space.

Amphenol, a leader in interconnect technology, has pioneered its EDSFF E1/E3 high-speed interconnects. Amphenol's EDSFF E1/E3 connector series is designed to meet the demands of demanding enterprise applications. Thanks to their ruggedised construction and advanced thermal management, the solutions ensure consistent performance even under high workloads and challenging operating environments. Thanks to this innovative technology, we are able to transmit power and high-speed signals by directly connecting cables and main PCB boards supporting modules such as EDSFF E1/E3 SSDs, CXLs, and more.

The EDSFF two-piece cable solution supports PCIe ® 5.0 specification-level data transfer rates (32Gb/s). The solution uses Mini Cool Edge 1C/2C connectors with EDSFF's standard-grade interfaces on one end of the cable, while the other end offers the flexibility to choose connectors in other packages, such as MCIO, Multi-Trak ™, backplane connectors, and so on.

Ideal for server systems in high-speed computing data centres, this solution eliminates the need for backplanes and multiple levels of PCB motherboard wiring to carry PCIe ® high-speed signals. Instead, high-speed signals are efficiently transmitted via high-speed cables that connect directly to the motherboard.

Power and sideband (low-speed) signals are transferred to the small PCB via MCIO board connectors. A power cable is also provided for connection to the motherboard for power supply. The sideband signals are transmitted via the chipset inside the small PCB and back to the card via the same MCIO board connector for seamless transmission to the motherboard.

This innovative technology not only saves the cost of the motherboard PCB, but also reduces the cost of the backplane PCB, and enhances design flexibility by integrating the small PCB within the system architecture.

Amphenol offers a wide range of finished cable solutions, including Gen 5 EDSFF orthogonal 2/4/8 channel and MCIO/Multi-Trak™ 8/16 channel cable assemblies, equipped with standard interfaces to support support EDSFF E1/E3 SSDs, CXL and other modules.

The focus on EDSFF E1/E3 technology development is not only to meet current storage needs, but also to develop a future-proof infrastructure. With high reliability, high performance and excellent performance, Amphenol's EDSFF E1/E3 high-speed cable assemblies are an indispensable part of the modern data centre infrastructure.