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Device overview:

The ADUCM3027 Ultra-Low Power (ULP) microcontroller (MCU) is a 32-bit ARM® Cortex-M3 kernel based MCU that can be easily configured to achieve balanced performance and power consumption while still providing critical safety and reliability features. These fast MCUS have a high ULPBench ™ certification score of 245.5 points. The standard was established by the Embedded Microprocessor Benchmark Consortium (EEMBC), an independent industry consortium.

The combination of hardware and software protection mechanisms enables faster encryption and provides read protection that prevents unauthorized users from reading device contents. In addition, online write protection prevents the device from being reprogrammed with unauthorized code. With voltage monitoring in standby mode and error correction for flash memory, the device improves reliability by avoiding damage that can lead to misoperation or system crash.

ADUCM3027BCBZ Technical parameters:

Core processor: ARM® Cortex®-M3

Kernel specification: 32-bit single-core

Speed: 26MHz

Connection capability: I²C, SPI, UART/USART

Peripheral: DMA, POR, PWM, WDT

Number of I/ OS: 36

Program storage capacity: 128KB (128K x 8)

Program memory type: Flash

EEPROM capacity: -

RAM size: 96K x 8

Voltage - power supply (Vcc/Vdd) : 1.74V ~ 3.6V

Data converter: A/D 8x12b

Oscillator type: Internal

Operating temperature: -40°C ~ 85°C (TA)

Mounting type: Surface mount type

Package/housing: 54-UFBGA, WLCSP

Supplier Package: 54-WLCSP (2.76x2.76)

ADUCM3027BCPZ Technical Specifications:

Core processor: ARM® Cortex®-M3

Kernel specification: 32-bit single-core

Speed: 26MHz

Connection capability: I²C, SPI, UART/USART

Peripheral: DMA, POR, PWM, WDT

Number of I/ OS: 44

Program storage capacity: 128KB (128K x 8)

Program memory type: Flash

EEPROM capacity: -

RAM size: 96K x 8

Voltage - power supply (Vcc/Vdd) : 1.74V ~ 3.6V

Data converter: A/D 8x12b

Oscillator type: Internal

Operating temperature: -40°C ~ 85°C (TA)

Mounting type: Surface mount type

Package/Housing: 64-WFQFN bare pad, CSP

Supplier Package: 64-LFCSP-WQ (9x9)

Applications:

• Internet of Things (IoT)

• Electronic Shelf labels (ESL) and signs

• Smart infrastructure

• Smart lock

• Asset tracking

• Smart machines, smart metering, smart buildings, smart cities and smart agriculture

• Wearable devices

• Fitness and clinical

• Machine learning and neural networks;

If necessary, please contact Mr. Chen:

Email: sales@hkmjd.com

Company website: www.hkmjd.com