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Melexis announced the launch of a new pressure sensor chip, the MLX90833, which uses innovative Triphibian technology to accurately measure pressure in gas and liquid media from 2 to 70bar, and all functions are integrated in a compact SO16 package. The device has been calibrated at the factory to output accurate absolute pressure readings through the LIN digital interface, helping heat pump manufacturers simplify the integration process and increase production efficiency.

Thermal management systems are becoming increasingly complex and the demand for LIN is growing

With the diversification of heating and cooling modes in heat pump systems, especially electric vehicle (EV) heat pump systems, there is an increasing demand for independent sensor chips with digital interfaces. Heat pump systems typically include key components such as intelligent expansion valves, refrigerant pumps, and compressors, which need to communicate effectively with a central control unit to precisely control temperature. The application of LIN and other digital bus technology can reduce the complexity of wiring, improve the level of system intelligence and achieve advanced diagnostic functions. LIN is becoming more widely used in Europe and is rapidly replacing traditional analog sensor outputs.

Triphibian technology is used to simplify the system design

In a pure electric vehicle (BEV) heat pump system, five or more pressure and temperature sensor chips may be required to ensure excellent performance. These sensor chips play a vital role in regulating the various expansion valves in high-pressure electric compressors and control systems. The MLX90833 integrates a LIN interface, which simplifies data transfer and system design compared to traditional analog or SENT connections.

In addition, Melexis Triphibian products are calibrated from the factory, helping customers significantly reduce development time and complexity. With non-Triphibian solutions, customers not only need to purchase separate sensing elements and signal conditioning chips, but also invest in end-line calibration equipment. If the MLX90833 is used, the above investment is not required and can be integrated at any time. This greatly simplifies the module design process and reduces manufacturing costs.

Major features of MLX90833:

Extended to a wider pressure range: MEMS sensor chips can measure pressures up to 70bar, breaking the measurement limits of traditional sensor chips.

Measurement of gas and liquid media pressure: Provides accurate pressure readings for both gas and liquid media, simplifying system design.

LIN digital output: Supports seamless integration into bus-connected systems, reducing wiring complexity.

Enhanced reliability: Advanced protection against hardware damage caused by overvoltage (+40V) and reverse voltage (-40V) for demanding applications such as trucks.

Laurent Otte, Senior Product Line Director at Melexis, said: "The MLX90833 will have a disruptive impact on heat pump manufacturers. The chip's ability to measure not only high pressures, but also accurate pressure measurements in both gas and liquid media, combined with the LIN interface, significantly simplifies system design and improves overall efficiency."

The MLX90833 is a fully integrated solution that includes MEMS sensors, signal conditioning circuits, and digital output drivers. With excellent pressure measurement accuracy (±0.5%FSO), it is a stand-alone safety element (SEooC) developed according to ISO 26262 to meet the stringent safety requirements of modern electric vehicles.

For more information, please visit http://www.melexis.com/MLX90833.

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