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Nexperia today announced a series of new logic ICs in the miniature automotive-grade MicroPak XSON5 pinless package, designed for space-constrained applications in complex automotive scenarios such as chassis safety, battery monitoring, infotainment, and advanced driver assistance systems (ADAS). The MicroPak XSON5 is housed in a thermally-enhanced plastic case that reduces PCB area by 75% compared to traditional pinned micro logic packages. In addition, the package features side-wetted pads to support automated optical inspection (AOI) of solder joints.

This product launch reinforces Nexperia's leadership position in the logic device industry with innovative packaging technology that meets the growing needs of the automotive industry. Pinless packages with side-wetted pads support the use of AOI technology to check solder joint quality, thereby increasing production reliability and speeding up board production. This not only helps to reduce costs, but also ensures that solder joints are fully soldered to meet stringent standards.

Nexperia's SOT8065-1 MicroPak XSON5 has five pins and measures just 1.1mm × 0.85mm × 0.47mm, making it ideal for space-constrained automotive applications. It does not have delamination problems and has excellent moisture resistance to MSL-1. 7 mm tin layer evenly covers both sides and bottom of the pad to effectively prevent oxidation and comply with RoHS and ‘Deep Green’ standards. SOT8065-1 can be packaged in the same wafer size as SOT353, but it occupies a smaller PCB area and has excellent solder durability and enhanced electrical performance.

To meet the growing demand for miniature logic ICs in the automotive industry, Nexperia has introduced 64 devices in the AEC-Q100 certified MicroPak XSON5 package.