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Amphenol offers an industry-leading, comprehensive range of backplane connectors and cables. With support for transfer speeds up to 224G and compliance with PCIe ® Gen7 class specification standards, these innovatively designed interconnect solutions are redefining connectivity standards. Designed to outperform all high-speed applications, these connectors and cables optimise space utilisation without compromising performance, while providing market-leading high-density solutions.

Excellent signal integrity (SI) and mechanical engineering (ME) performance ensures uninterrupted data transfer even in extremely demanding environments. Amphenol further strengthens its position as a leader in high-speed interconnect solutions with strong global manufacturing capabilities and unrivalled production capacity.

The Amphenol Paladin® High Density Interconnect System is at the forefront of innovation. With support for bandwidths of up to 112Gb/s to 224Gb/s, the system sets a new benchmark for all high-speed applications. Designed to meet a variety of extremely demanding data-intensive environments, it offers industry-leading density, accommodating up to 144 differential pairs in 1U spacing.

Ideally suited to cloud servers for high-performance computing, the Paladin® High Density Interconnect System features a balanced pair construction consisting of individually assembled and individually shielded differential pairs with a uniquely designed hybrid board accessory that dramatically increases density and optimises electrical performance.

Amphenol's ExaMAX® backplane connector system is an innovative technology. It supports data rates ranging from 25G to over 112G, complies with PCIe® Gen4 and beyond, and supports seamless upgrades without compromising performance. The backplane connector system is designed to meet the 56Gb/s PAM4 class industry specification, providing ample SI margin while being compatible with interfaces from earlier ExaMAX® products.

Amphenol's new EXAMAX2® backplane connector system is compliant with the 112Gb/s PAM4 class industry specification and is specifically optimised to meet the demanding electrical and mechanical requirements of 112G systems. Additionally, the system features a ruggedised design to meet tight space constraints, making it an ideal solution for compact applications with high density requirements. The connectors are optimised to provide excellent signal integrity, resulting in reduced crosstalk noise and improved insertion loss crosstalk ratio.

Amphenol's XCede® high-density backplane connectors represent a major leap forward in high-speed data transmission technology, with impressive transmission performance of up to 20 Gb/s. The connectors are available in a hard metric form factor. The connectors are available in a hard metric form factor and offer excellent linear density of up to 84 differential pairs per inch (33 differential pairs per centimetre). This represents a significant 35 per cent increase in density compared to standard XCede@ connectors, making it a leader in high-density interconnect solutions.

Available in 85Ω and 100Ω impedance versions that can be customised to meet specific needs, the XCede® high-density connectors combine cutting-edge technology, upgraded density and versatile configurations to set a new benchmark for high-performance data connectivity in demanding applications.

AirMAX® is the heritage brand of Amphenol's family of hard metric backplane connectors, supporting a wide range of serial architectures. airMAX® is compatible with the ExaMAX® family, and its guide and power modules play an important role in ensuring easy integration into Open Computing Project (OCP) designs. airMAX® is compliant with industry standards and specifications, and the components used facilitate the use of high-speed interconnect solutions, thus increasing the adoption of different platforms. AirMAX® is compliant with industry standards and specifications, and the components used facilitate the adoption of high-speed interconnect solutions that improve connectivity efficiency and scalability across different platforms.

High-speed backplane connectors and cables have become a staple of modern technology, supporting the exchange of data between applications. With the advent of digital transformation, Amphenol is committed to developing innovative, cutting-edge interconnect solutions that are built to last and adapt to the connectivity needs of the future. View our wide range of high-speed backplane connectors and their applications to find the right product for your design requirements.