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Important components of Apple's M2 series chips will continue to be supplied by Samsung
According to Korean media reports on April 24, it is understood that Apples current M1 series chips are used in its MacBook, Mac and iPad product lines. Therefore, Apple attaches great importance to the supply of this self-developed chip.Samsung, as o…
According to Korean media reports on April 24, it is understood that Apple's current M1 series chips are used in its MacBook, Mac and iPad product lines. Therefore, Apple attaches great importance to the supply of this self-developed chip.
Samsung, as one of the suppliers, is currently involved in the production of FC-BGA substrates, which are essential for modern high-density chips with circuit connections. According to the latest news, the South Korean tech giant also wants to be involved in the production of Apple's M2 series of chips.
According to reports, Apple's M2 series chips will continue to be supplied by Samsung for FC-BGA packaging substrates. FC-BGA (Flip Chip Ball Grid Array) is a flip chip ball grid array package format, which is mainly used to solder semiconductor chips to the main substrate. One year after the launch of Apple's M1 series chips, some media discovered that the FC-BGA package substrate came from Samsung.
Earlier, insiders broke the news that after Apple's M1 series chips were released, the company immediately began to design M2 series chips. Not long ago, news from Bloomberg said that Apple is developing at least 9 Macs equipped with M2 series chips. Among them, the first M2 device may be launched in the second half of this year.
Time:2024-07-02
Time:2024-07-02
Time:2024-07-02
Time:2024-07-02
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