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Trade Name:MGM13S12F512GN-V3R
Brand:SILICON
Particular Year:24+
Package:51-SMD
Delivery Date:New and original
Stock: 1000pcs
Description: The MGM13S12F512GN-V3R is an ultra-small system-level package for 802.15.4 mesh networking and multi-protocol connectivity. It is a SIP module for Zigbee, Thread, Bluetooth 5.0LE and dynamic multi-protocol (Zigbee + Bluetooth) connections built around EFR32MG13 SoCs, with strong RF performance and low energy consumption, and has been certified for regulatory compliance. It also offers a variety of MCU peripherals and a simplified development experience, all in a small 6.5x6.5x1.4mm package.
Product attribute
Rf series/Standard: 802.15.4, Bluetooth
Protocol: Bluetooth v5.0, Thread, Zigbee®
Modulation: DSSS, GFSK, O-QPSK
Frequency: 2.4GHz
Data rate: 2Mbps
Power - Output: 18dBm
Sensitivity: -101.5dBm
Serial interface: I2C, I2S, IrDA, SPI, UART
Antenna type: No antenna
IC/ part used: EFR32MG13
Storage capacity: 512kB flash, 64kB RAM
Voltage - Power supply: 1.8V ~ 3.8V
Current - Reception: 10.5mA
Current - Transmission: 8.9mA
Mounting type: Surface mount type
Operating temperature: -40°C ~ 85°C (TA)
Package/shell: 51-SMD module
Basic product number: MGM13S12
Model
Brand
Package
Quantity
Describe
Murata
Module
1000
The 2AE Wi-Fi+ Bluetooth module based on Infineon's CYW4373E chipset
Murata
Module
1000
The 1YN Wi-Fi®+ Bluetooth module based on Infineon's CYW43439 chipset
QUALCOMM
BGA
1000
Combined wireless module 2.4Ghz, 5Ghz, 1x1, dual-band switchable, 802.11ac, WSI2.0
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