sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:10CL080YF780C8G
Data Manual:10CL080YF780C8G.pdf
Brand:Intel
Particular Year:23+
Package:FBGA-780
Delivery Date:New original
Stock: 2000pcs
The 10CL080YF780C8G is optimised for low-power, low-cost applications such as I/O expansion, sensor fusion, motor/motion control, chip-to-chip bridging, and board management control.
The Cyclone® 10 LP supports vertical migration. It is possible to start a design from one device and migrate to adjacent devices after finalising the design.
Intel® Cyclone® 10 LP Features:
Low-cost, low-power FPGA architecture
1.0V and 1.2V core voltage options
Suitable for commercial, industrial and automotive temperature grades
Several package types and space layouts:
FineLine BGA (FBGA)
Enhanced Thin Quad Flat Pack (EQFP)
Ultra FineLine BGA (UBGA)
Micro FineLine BGA (MBGA)
Multi-device density with pin migration capability
RoHS6 compliant
Logic Cells - Four-Input Look-Up Tables (LUTs) and Registers
Rich wiring/metal interconnect between all LEs
M9K - 9 Kilobit (Kb) Embedded SRAM Memory Module, Cascadable
Intel® Cyclone® 10 LP applications:
I/O Expansion
Interface
Bridging
Sensor fusion
Industrial Motor Control
Model
Brand
Package
Quantity
Describe
Xilinx
196-CSPBGA
1000
Spartan®-7 Field Programmable Gate Array (FPGA) IC,196-TFBGA, CSBGA
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Intel is a global leader in the semiconductor industry and computing innovation, founded in 1968. Today, Intel is transforming into a data-centric company. Together with its partners, Intel promotes innovation and application breakthroughs in transfor…
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