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sales@hkmjd.com
sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:5ASXBB3D6F31C6G
Data Manual:
5ASXBB3D6F31C6G.pdf
Brand:Intel
Particular Year:23+
Package:896-BBGA
Delivery Date:New and Original
Stock: 1000pcs
5ASXBB3D6F31C6G At input currents less than 100 mA and periods shorter than 20 ns, the input signal may undershoot to -2.0 V. The maximum allowable overshoot duration is specified as a percentage of the time it is high during the life of the device. The DC signal corresponds to 100% duty cycle.
Product Attributes
Architecture: MCU, FPGA
Core Processor: Dual-core ARM® Cortex®-A9 MPCore™ with CoreSight
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Key Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package/Housing: 896-BBGA, FCBGA
Vendor Device Package: 896-FBGA (31x31)
I/O Count: MCU - 208, FPGA - 250
Model
Brand
Package
Quantity
Describe
Microchip
TFBGA-325
2000
SmartFusion®2 SoC FPGA based on 166MHz Arm® Cortex®-M3 CPU
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