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sales@hkmjd.com
sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:1SX040HH3F35E3VG
Data Manual:
1SX040HH3F35E3VG.pdf
Brand:Intel
Particular Year:23+
Package:1152-BBGA
Delivery Date:New and Original
Stock: 1000pcs
1SX040HH3F35E3VG At input currents less than 100 mA and periods shorter than 20 ns, the input signal may undershoot to -1.1 V. The maximum allowable overshoot duration is specified as a percentage of the time at high level over the life of the device. A DC signal is equivalent to 100% duty cycle. For example, when using VCCIO = 1.8 V, an LVDS I/O signal that overshoots to 2.44 V can only be at 2.44 V for ~6% of the life of the device, and the signal can only be held at 2.44 V for ~6% of the life of the device.
Product Attributes
Architecture: MCU, FPGA
Core Processor: Quad-Core ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, floating point
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Key Attributes: FPGA - 400K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package/Housing: 1152-BBGA, FCBGA
Vendor Device Package: 1152-FBGA (35x35)
Number of I/Os: 374
Model
Brand
Package
Quantity
Describe
Microchip
TFBGA-325
2000
SmartFusion®2 SoC FPGA based on 166MHz Arm® Cortex®-M3 CPU
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