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Agency: Three major memory chip makers own 76% of leading-edge process capacity

Agency: Three major memory chip makers own 76% of leading-edge process capacity

Source:our siteTime:2023-03-04Views:

By the end of 2022, the three largest storage semiconductor manufacturers, including Samsung and Micron, together will own 76% of the leading-edge process capacity, the vast majority of which will be used for advanced DRAM and 3D NAND production.

March 4 news, according to research firm Knometa Research released a global wafer capacity report analysis, by the end of 2022, Samsung, Micron and other three major storage semiconductor manufacturers together have 76% of the frontier process capacity, the vast majority of which is used for advanced DRAM and 3D NAND production.

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According to the agency's classification criteria, frontier capacity includes foundries 3-6nm, Intel 4-7nm, DRAM manufacturers 11-14nm, NAND manufacturers greater than 176 layers of 3D NAND; the rest of the front-end IC manufacturing capacity by "sub-frontier" process (foundry 7-16nm), mature process (20nm-0.11µm), and the most advanced process. The rest of the front-end IC manufacturing capacity is classified by "sub-frontier" process (foundry 7-16nm), mature process (20nm-0.11µm), and large linewidth process (0.13µm+ process).


The report also shows that Samsung is the industry's largest owner of frontier and sub-frontier capacity by the end of 2022. The company is the industry's largest supplier of DRAM and NAND flash products, and one of the largest manufacturers of advanced logic products such as low-power.


Foundry giant TSMC, which ranks in the top five in all four process categories, currently has 39 fab lines offering a diverse portfolio of process technologies, with other pure foundries such as UMC and SMIC playing an important role in mature technologies.

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