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Intel, Samsung, Ericsson and IBM are working together on the next generation of chips
Samsung, Ericsson, IBM and Intel will work together in the areas of device performance, chip and system level, recyclability, environmental impact and manufacturability.
February 2 - Samsung, Intel, IBM and Ericsson are reportedly working together to research and develop next-generation chips as part of the National Science Foundation's (NSF) Future of Semiconductors (FuSe) program, which has received $50 million in funding.
NSF and the four technology giants will develop next-generation chips based on "co-design" in different areas. Samsung, Ericsson, IBM and Intel will work together in areas such as device performance, chip and system level, recyclability, environmental impact and manufacturability.
The NSF director said, "The future of semiconductors and microelectronics will require the involvement of a full range of talent across materials, devices and systems, as well as academic and industrial fields."
With $50 million in funding, NSF aims for this partnership between Samsung, Ericsson, IBM and Intel "to inform research needs, stimulate innovation, accelerate the translation of results to market and prepare the workforce of the future."
Exactly when the consumer and enterprise markets will see the results of these collaborations for next-generation computing technologies is yet to be determined.
Time:2024-04-26
Time:2024-04-26
Time:2024-04-26
Time:2024-04-26
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