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Samsung Electronics plans to expand DRAM and foundry capacity next year
Samsung Electronics plans to increase its chip production capacity at its largest semiconductor plant next year, despite a global economic slowdown next year.
December 26, South Korea's Seoul Economic Daily said that Samsung Electronics plans to increase chip production capacity at its largest semiconductor plant next year despite a global economic slowdown next year. It is said that Samsung 2023 memory and system semiconductor wafer production capacity by about 10%.
Samsung's P3 fab in Pyeongtaek will reportedly expand its DRAM equipment to produce 70,000 12-inch wafers per month, compared to the current capacity of 20,000 wafers per month for the P3 fab's DRAM production line. Samsung expects to use the new facility to produce 12nm DRAM, and as of Q3, Samsung's total monthly DRAM wafer production was 665,000 wafers.
In addition, Samsung is planning to increase the monthly wafer production of its P3 fab by 30,000 wafers. As of Q3, Samsung's overall monthly wafer foundry production was 476,000 wafers.
Not long ago, Samsung announced the launch of the industry's most advanced 12nm-class high-performance and low-power DDR5 DRAM, which it plans to start mass production from next year and supply to various customers such as data centres and artificial intelligence.
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
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