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Renesas Electronics Corporation today announced the launch of the first complete memory interface chipset solution for the second-generation DDR5 multi-capacity dual-in-line memory module (MRDIMM).

Increasing memory bandwidth requirements for artificial intelligence (AI), high performance computing (HPC), and other data center applications require new DDR5 MRDIMMs. They operate at speeds of up to 12,800 megabits per second (MT/s); 1.35 times more memory bandwidth than the first generation solution. Working with industry leaders, including CPU and memory vendors, and end customers, Renesas played a key role in the design, development and deployment of the new MRDIMMs.

Renesas has designed and introduced three new key components: the RRG50120 second generation multiplexed Register Clock Driver (MRCD), the RRG51020 second generation multiplexed Data Buffer (MDB), and the RRG53220 second generation Power Management Integrated Circuit (PMIC). In addition, Renesas mass-produces temperature sensor (TS) and Serial Presence detection (SPD) hub solutions and offers a comprehensive range of chipset solutions for a wide range of server and client DIMMs, including industry-standard next-generation MRDIMMs. As a leading manufacturer in the field of memory interfaces, Renesas is committed to providing users with high-quality, high-performance products and services.

Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing said: "The demand for higher performance systems for AI and HPC applications continues to grow. Renesas follows this trend and works with industry leaders to develop the next generation of technologies and specifications. These companies rely on the technical expertise and production capacity provided by Renesas to meet the growing demand. Our latest chipset solution for the second generation DDR5 MRDIMMs demonstrates Renesas' exceptional position in this market segment."

Renesas RRG50120 second generation MRCD for MRDIMMs, buffering the command/address (CA) bus, chip selection and clock between the host controller and the DRAM. Compared to the first generation, the power consumption is reduced by 45%. This is a key metric for thermal management of ultra-high-speed systems. The RRG51020 Gen 2 MDB is another key device used in MRDIMMs to buffer data from the host CPU to the DRAM. Renesas' new MRCD and MDB both support speeds of up to 12.8 gigabits per second (Gbps). In addition, Renesas' RRG53220 next generation PMIC offers excellent electrical overvoltage protection and superior energy efficiency, optimized for high current and low voltage operation. For more information, please visit www.renesas.com/DDR5.

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