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According to independent journalist Tim Culpan, sources say that AMD has reached an agreement with TSMC to produce high-performance chips at the latter's new factory in Arizona. This will make AMD the second high-profile customer for the plant after Apple.

TSMC's Fab 21, located near Phoenix, Arizona, is understood to have begun pilot production of 5nm process nodes, including the N4/N4P/N4X and N5/N5P/N5X processes. While its first phase of production has yet to fully kick off, Apple's A16 Bionic chips are currently being produced at Fab 21 using the N4P process. Bloomberg reported last month that Fab 21's current yields are similar to TSMC's Taiwan plant.

However, the chips AMD plans to produce at Fab 21 are not yet known. According to the source, production plans are underway, with chip flow and manufacturing set to begin in Arizona next year. the first phase of Fab 21 is limited to N4 and N5 technologies, which rules out the production of more advanced consumer chips than the RDNA 3 and Zen 4, with AMD's CDNA 3 series of enterprise AI chips for the Instinct MI300 series of accelerators being a likely candidate. chips for AMD's CDNA 3 series of enterprise AI accelerators for the Instinct MI300 series of accelerators are likely candidates.

AMD HPC chips manufactured in Arizona must first be shipped overseas for packaging. However, the recent agreement between Amkor and TSMC to collaborate on advanced packaging in Arizona will further solidify the AI chip supply chain in the U.S. Amkor's $2 billion Arizona chip test and packaging facility, currently under construction and expected to begin production in 2026, will be allowed to use TSMC's proprietary CoWoS and InFO packaging technologies, enabling AI and HPC chips to be packaged more completely in the US.