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SK Hynix first in the world to achieve mass production of 12-layer HBM3E products
Sept. 26 -- South Koreas SK Hynix has announced that it has begun mass production of the worlds first 12-layer HBM3E product with a capacity of 36GB, the largest capacity of an existing HBM to date.SK Hynix claims that the 12-layer HBM3E product meets…
Sept. 26 -- South Korea's SK Hynix has announced that it has begun mass production of the world's first 12-layer HBM3E product with a capacity of 36GB, the largest capacity of an existing HBM to date.
SK Hynix claims that the 12-layer HBM3E product meets the world's highest standards for speed, capacity and stability. The company plans to offer mass production products to customers within the year.
SK Hynix shares surged on the Korean stock market on Thursday on the news. As of press time, the company's share price had risen 8.89 per cent during the day.
According to the company, the 12-layer HBM3E product meets the world's highest standards in all areas necessary for AI memory, including speed, capacity and stability.
SK Hynix has increased the memory operating speed to 9.6 Gbps, which is the highest memory speed currently available. If the large-scale language model Llama 3 70b is driven by a single GPU carrying four HBM3E products, a total of 70 billion parameters can be read 35 times per second.
SK Hynix's 12-layer product represents a 50 per cent increase in capacity compared to the previous 8-layer product of the same thickness. To achieve this, the company made each DRAM chip 40 per cent thinner than before and vertically stacked it using TSV technology.
The company also solved the structural problems caused by stacking thinner chips higher by applying its core technology, the Advanced MR-MUF process. This has resulted in a new generation of products with 10 per cent higher thermal performance than their predecessors, and ensures product stability and reliability through enhanced warpage control.
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
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Time:2024-11-18
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