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TrendForce: Samsung Electronics HBM3E Memory Validated by NVIDIA, 8Hi Product Availability Begins
On September 4, TrendForce said in yesterdays report that Samsung Electronics HBM3E memory products “have completed validation and have begun formal shipments of HBM3E 8Hi (note: that is, 24GB capacity), mainly for H200, while validation of the Black…
On September 4, TrendForce said in yesterday's report that Samsung Electronics' HBM3E memory products “have completed validation and have begun formal shipments of HBM3E 8Hi (note: that is, 24GB capacity), mainly for H200, while validation of the Blackwell series is progressing steadily! “.
TrendForce mentioned in this NVIDIA AI GPU report that Micron and SK Hynix have passed NVIDIA's HBM3E validation at the end of the first quarter of 2024, and have begun to ship in volume since the second quarter, with Micron's products mainly used in the H200, while SK Hynix is supplying to both the H200 and B100 series.
The organization estimates that nearly 90% of NVIDIA's GPU product line in 2024 will belong to the Hopper generation platform, and from the second half of the year, NVIDIA will adopt a no-price-cut strategy for the H100 products, and will use the H200 as the main supply force in the market after customers have finished the shipment of their previous orders.
For the next generation of Blackwell, the report believes that the platform will be officially released in 2025. In addition, due to changes in chip design, Blackwell products will drive TSMC's CoWoS demand.
TSMC has recently further increased its CoWoS advanced packaging capacity plan for the end of 2025, which is expected to reach 70,000~80,000 wafers per month, doubling its capacity from 2024, and more than half of which will be taken by NVIDIA.
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
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