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SK Hynix introduces the world's highest performance new generation of video memory product GDDR7

SK Hynix introduces the world's highest performance new generation of video memory product GDDR7

Source:our siteTime:2024-09-04Views:

Seoul, South Korea, July 30, 2024 -- SK Hynix (or the Company, https://www.skhynix.com) today announced the introduction of the GDDR7, the worlds highest-performing next-generation video memory product.• 60% faster and 50% more energy efficient than …

Seoul, South Korea, July 30, 2024 -- SK Hynix (or 'the Company', https://www.skhynix.com) today announced the introduction of the GDDR7, the world's highest-performing next-generation video memory product.


• 60% faster and 50% more energy efficient than the previous generation, achieving the highest memory performance available

• Equipped with the latest graphics card, it can process 300 full HD movies in 1 second

• "Mass production will begin in the third quarter of this year, and will be applied to a variety of fields such as graphics processing, artificial intelligence, high-performance computing, and autonomous driving."


SK Hynix said, "GDDR is attracting increasing attention from AI application customers around the world due to its performance and high speed for graphics processing. In line with this trend, the company completed the development of the latest GDDR7 in March this year, and will officially launch this time and start mass production in the third quarter of this year."


SK Hynix's GDDR7 achieves an operating speed of up to 32Gbps (32 gigabytes per second), which is more than 60 percent higher than the previous generation, and the speed can reach up to 40Gbps depending on the use environment. The device is equipped with the latest graphics card and can handle more than 1.5 terabytes of data per second, which is equivalent to processing 300 Full-HD movies (5GB) in one second.


In addition, GDDR7 provides faster speeds while increasing energy efficiency by more than 50% compared to the previous generation. SK Hynix adopted Packaging technology in the product development process to solve the problem of chip heating caused by ultra-high-speed data processing.

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SK Hynix's technical team, while maintaining product size, increased the heat release substrate used for packaging from four to six layers, and used epoxy resin molding (EMC) with high thermal conductivity in the packaging material. As a result, the technical team succeeded in reducing the thermal resistance of the product by 74% compared to the previous generation.


Lee Sang-kwon, vice president of DRAM PP&E at SK Hynix, said, "GDDR7 from SK Hynix has achieved the highest performance of existing graphics chips with excellent speed and energy efficiency, and its application range will be expanded from high-performance 3D graphics to artificial intelligence, high-performance computing and autonomous driving. With this product, the company will further strengthen its high-end memory product line and become the most trusted AI memory solution company for customers."


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