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Samtec HDAM-11-12.0-S-13-2-P HD Mezz Rugged High-Density Open-Pin-Field Array Terminal Connector

Samtec HDAM-11-12.0-S-13-2-P HD Mezz Rugged High-Density Open-Pin-Field Array Terminal Connector

Source:our siteTime:2024-08-31Views:

Samtec HDAM-11-12.0-S-13-2-P HD Mezz Rugged High-Density Open-Pin-Field Array Terminal ConnectorProduct DescriptionHDAM-11-12.0-S-13-2-P is HD Mezz Rugged High-Density Open-Pin-Field Array Terminal Connector.SpecificationsProduct: PlugsNumber of Posit…

Samtec HDAM-11-12.0-S-13-2-P HD Mezz Rugged High-Density Open-Pin-Field Array Terminal Connector


Product Description

HDAM-11-12.0-S-13-2-P is HD Mezz Rugged High-Density Open-Pin-Field Array Terminal Connector.


Specifications

Product: Plugs

Number of Positions: 143 Position

Pitch: 1.2 mm (0.047 in)

Number of Rows: 13 Row

Termination Style: Solder

Stack Height: 20 mm, 30 mm

Current Rating: 3.4 A

Voltage Rating: 200 VAC

Minimum Operating Temperature: - 55 C

Maximum Operating Temperature: + 125 C

Contact Plating: Gold

Contact Material: Copper Alloy

Housing Material: Liquid Crystal Polymer (LCP)


Feature

2.00 mm x 1.20 mm pitch

HD Mezz is a trademark of Molex Incorporated

Integrated guide posts to minimize contact damage when mating and unmating

Intermateable with Molex HD Mezz Arrays

Open pin field design

Performance: Up to 9 GHz / 18 Gbps

Solder charge termination for ease of processing

Up to 299 I/Os

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