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Currently, the global artificial intelligence industry is developing at a high speed, and the market size is increasing. Statistics show that the global AI industry market size is expected to reach about $3,513.7 billion in 2024, which is a huge market space. In the cloud, we have seen the 100-mode war; in the edge, smart cars, smartphones and AI PCs are expected to be the next killer application of pervasive AI. Both the cloud and the edge, the demand for computing power is growing exponentially, putting forward higher requirements for chip computing performance.

On 27 August, the 8th AI Conference 2024, jointly organised by eFever.com and elexcon2024 Shenzhen International Electronics Exhibition & Embedded Exhibition and Semiconductor Exhibition, was successfully held.

Renesas Electronics China market development department product senior manager Shi Lingfeng shared the theme of ‘all “core” empowered edge-AI Renesas new generation of DRP-AI technology introduction’, a detailed introduction to the technical principles of DRP-AI, the development process, and elaborated on the DRP-AI3 let RZ/V2H microprocessor in AI with excellent performance. excellent performance performance.

DRP-AI is Dynamically Reconfigurable Processor for AI, which means Dynamically Reconfigurable Processor for Artificial Intelligence. It has the low power consumption and flexibility required for edge devices, and the programmable hardware allows both ‘software flexibility’ and ‘hardware speed’. Programmable hardware allows both ‘software flexibility’ and ‘hardware speed’.

After years of technology iteration, DRP-AI has now evolved to DRP-AI3, which provides a 10TOPS/W energy-efficient architecture that saves memory space and power consumption in MAC operations; supports high-performance AI inference, with pre-processing handled by the DRP without CPU intervention, and a performance of 8TOPS@Dense or 80TOPS@Sparse; and features easy development for different models. development, with development tools for different models and a rich AI application set and training library from Renesas Electronics. Compared to its predecessor, the next-generation DRP-AI3 delivers more than 10 times the arithmetic performance, 14 times the computing power of the Dense model, and 45 times the computing power of the Sparse model.

Thanks to the outstanding performance, development boards equipped with the Renesas Electronics RZ/V2H microprocessor can execute AI reasoning without a fan, with the same case temperature as fan-equipped competitors. To help engineers take advantage of DRP-AI3 technology, Renesas Electronics provides resources such as AI SDKs, model conversion tools and extension packs that support the DRP-AI architecture. With these resources, engineers and friends can quickly build vision AI applications such as traffic monitoring and humanoid robots based on the RZ/V2H microprocessor.