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Recently, Alpha and Omega Semiconductor Limited (AOS, NASDAQ: AOS), a well-known supplier of power semiconductors, chips and digital power supplies, integrates design, development, production and global sales. AOSL has introduced the AONG36322 XSPairFET, designed for space-constrained DC-DC applications. The new AONG36322 features two 30V MOSFETs in a half-bridge configuration that integrates high - and low-side power MOSFETs in an asymmetric DFN3.5x5 XSPairFET package. This innovative design enables the AONG36322 to replace the existing DFN5x6 asymmetric half-bridge MOSFETs with approximately 60% space savings, thereby reducing the PCB footprint and further simplifying the DC-DC architecture for more efficient design. These advantages make the AONG36322 ideal for a new generation of small DC-DC buck converters for more compact power converter applications such as point of load converters (POL), USB hubs and mobile power supplies.

The AONG36322 is an extended family of AOS XSPairFET designed with the latest bottom-source package technology. Integrate high - and low-side MOSFETs (with maximum on-resistances of 4.5 mOhms and 1.3 mOhms, respectively), where the low-side MOSFET source is directly connected to the bare pad on the PCB to enhance its thermal performance. An obvious advantage of the AONG36322 package design is its low parasitic inductance, which significantly reduces switching node ringing.

"We designed the AONG36322 in the DFN3.5x5 package to help customers meet their ongoing board space constraints. The breakthrough AOS XSPairFET design brings them higher power density and efficiency, overcoming the challenges designers face in meeting performance targets for growing point-of-load converter (POL Buck) applications." Said Peter H. Wilson, Senior Marketing Director for the AOS MOSFET product line.

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Article source: Electronic Engineering Album

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