sales@hkmjd.com
Service Telephone:86-755-83294757
The F3L8MR12W2M1HPB11 module is an Infineon EasyPACK™ 2B 1200 V / 8 mΩ three-level module. CoolSiC™ MOSFETs with enhanced first-generation trench technology, integrated NTC temperature sensors, pre-coated thermal interface materials and PressFIT cr…
The F3L8MR12W2M1HPB11 module is an Infineon EasyPACK™ 2B 1200 V / 8 mΩ three-level module. CoolSiC™ MOSFETs with enhanced first-generation trench technology, integrated NTC temperature sensors, pre-coated thermal interface materials and PressFIT crimp technology.
Features
• Electrical characteristics
- VDSS = 1200 V
- IDN = 100 A / IDRM = 200 A
- High current density
- Low switching loss
• Mechanical characteristics
- Integrated mounting clip for robust installation
- Integrated NTC temperature sensor
- PressFIT crimping technology
- Pre-coat thermal medium
Applications
• Solar energy applications
• Three-level application
• Electric vehicle DC charging
Product certification
• Meets the requirements of industrial applications according to IEC 60747, 60749 and 60068.
Time:2024-11-19
Time:2024-11-19
Time:2024-11-19
Time:2024-11-19
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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