Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Vishay Intertechnology, Inc. has announced the release of 16 new third-generation 1200 V Silicon Carbide (SiC) Schottky diodes.Vishay Semiconductors devices are designed with a Hybrid PIN Schottky (MPS) structure that offers high inrush current protection, low forward voltage drop, low capacitive charge and low reverse leakage current, helping to improve the energy efficiency and reliability of switching power supply designs.

The recently announced new generation of SiC diodes includes 5 A to 40 A devices in TO-220AC 2L, TO-247AD 2L and TO-247AD 3L plug-in packages and D2PAK 2L (TO-263AB 2L) surface mount packages. Due to the MPS structure - utilising laser annealing backside thinning - the diode capacitance charge is as low as 28 nC and the forward voltage drop is reduced to 1.35 V. Additionally, the device's typical reverse leakage current of only 2.5 μA at 25 C reduces Conduction losses are reduced, ensuring high energy efficiency during light load and no-load periods. Unlike ultra-fast recovery diodes, third-generation devices have virtually no recovery tail, enabling further efficiency gains.

Typical applications for silicon carbide diodes include AC/DC power factor correction (PFC) and DC/DC UHF output rectification for FBPS and LLC converters in photovoltaic inverters, energy storage systems, industrial drives and tools, data centres and more. The devices operate in these harsh environments at temperatures up to +175°C and are forward rated for surge current protection up to 260 A. In addition, the D2PAK 2L package diodes are moulded with a high CTI 600 to ensure excellent insulation at elevated voltages.

The devices are highly reliable, RoHS compliant, halogen-free, and have passed 2000 hours of High Temperature Reverse Bias (HTRB) testing and 2000 cycles of thermal cycling temperature cycling.

About VISHAY

Vishay is one of the world's largest manufacturers of a family of discrete semiconductors and passive electronic components that are critical to innovative design in the automotive, industrial, computing, consumer, communications, defence, aerospace and medical markets.