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Mingjiada Corporation New Infineon AIROC™ Bluetooth Module CYW20822P4EPI040XUMA1 Fully Integrated Bluetooth LE Wireless Module

Description:

The CYW20822P4EPI040XUMA1 module enables seamless integration, enhances performance by supporting Bluetooth® Low Power Long Range (LE-LR) and provides excellent reliability for a wide range of applications. The module combines low power consumption and high performance to support a variety of Bluetooth® LE-LR use cases, including industrial IoT applications, smart homes, asset tracking, beacons and sensors, and medical devices.

The module offers the following high performance:

-101 dBm LE sensitivity @ 125 Kbps

- Active RX @ 1 Mbps & -95 dBm: 1.3 mA

- Active TX @ 1 Mbps & 0 dBm: 3 mA

- LE Encoded PHY (LE/LR): 500 Kbps, 125 Kbps

- 2 uA deep sleep mode with 32 KB RAM retention

- 0.8 uA unreserved sleep mode

The module is certified by the Bluetooth SIG (Bluetooth Technology Alliance) as well as by the US FCC, European CE, Japanese MIC and Canadian ISED.

The CYW20822P4EPI040XUMA1 module features a tracking antenna, very low active power consumption of 1.3 mA (Rx @ -95 dBm) and 3 mA (Tx @ 0 dBm), and a sleep current consumption of 2 μA with 32 KB of RAM reserved.

Advantages

The CYW20822P4EPI040XUMA1 provides all the necessary components to run the Bluetooth® LE communication standard.

- Proven ready-to-use hardware design

- Cost-optimised for applications without space constraints

- Non-volatile memory for self-contained operation and over-the-air updates

- Bluetooth® SIG-listed QDIDs and Declaration IDs

- Fully certified module eliminates time required for design, development and certification processes

- Pre-loaded EZ-Serial firmware provides an easy-to-use command interface for configuring and using the module

Functional Block Diagram

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