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Tesla Dojo 3 Chip Supply Chain Adjustment: Samsung 2nm Process + Intel EMIB Packaging
On 8 August, South Korean media outlet ZDNET Korea reported that Tesla is considering a complete overhaul of its supply chain for its third-generation self-developed AI ASIC chip, Dojo 3. The front-end advanced process manufacturing will be handled by…
On 8 August, South Korean media outlet ZDNET Korea reported that Tesla is considering a complete overhaul of its supply chain for its third-generation self-developed AI ASIC chip, Dojo 3. The front-end advanced process manufacturing will be handled by Samsung Foundry, while the back-end advanced packaging will be managed by Intel.
It is worth noting that Tesla's Dojo 1 chip was entirely manufactured by TSMC using a 7nm advanced process and InFO-SoW large-area advanced packaging technology, while the second-generation product, Dojo 2, is expected to enter mass production by TSMC later this year.
Musk previously stated plans to unify AI6 and Dojo 3 into a single architecture, meaning Dojo 3 will not be developed independently but will instead reuse AI6's ASIC die and scale it up to a larger size.
Samsung Electronics' Taylor fab in the United States will provide 2nm process foundry services for the AI6 chip, and is therefore also expected to support Dojo 3; Intel, meanwhile, will adopt advanced packaging technology based on EMIB to connect multiple chip modules.
Time:2025-08-08
Time:2025-08-08
Time:2025-08-08
Time:2025-08-08
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