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According to news on August 22, among the three foundry giants, TSMC and Samsung are both fighting for 3nm, which has always attracted the attention of the global semiconductor industry. Due to the delay in development progress, TSMC fell behind Samsung, and was preempted by the latter to release 3nm at the end of June this year. South Korea's Samsung, the world's largest manufacturer of memory chips and second in foundry, is catching up with TSMC. At that time, TSMC's global foundry market share was 53.3%, followed by Samsung with 16.3%.

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In order not to repeat the "AMD grabbing Intel CPU incident", the foundry giant TSMC's 3nm N3 process will quickly enter mass production in September this year after completing technology research and development and trial production. It is expected that the number of films cast in the second half of the third quarter will start to increase significantly, and the monthly production volume of the fourth quarter will reach the level of thousands of films, and the mass production stage will begin. Equipment manufacturers pointed out that judging from the trial production of TSMC's N3 process, it is expected that after entering mass production in September, the initial yield performance will be better than the initial stage of the 5nm N5 process.

The president of TSMC said at a recent meeting that the company's N3 process progress is in line with expectations, and it will be mass-produced in the second half of 2022 with a good yield. Driven by HPC and smartphone-related applications, mass production will be stabilized in 2023, and revenue will be contributed in the first half of 2023.

In addition, the R&D results of the 3nm N3E (3nm enhanced version) process launched by TSMC optimized the N3 process are better than expected. The N3E process will be an extension of TSMC's 3nm family with better performance, power consumption and yield. Related applications provide a complete support platform in the 3nm process generation. The N3E process will enter mass production in the second half of 2023, and Apple and Intel will be the two major customers.

Although one of the competitors, Samsung foundry, has announced the successful mass production of 3nm in June, and announced that it is the first semiconductor factory in the industry to use the gate-around transistor (GAA) structure to cast wafers. TSMC 3nm still adopts fin type. Field effect transistor (FinFET) structure, but the N3 process has adopted the innovative TSMC FINFLEX technology to further improve the PPA (performance, power consumption and area) of the 3nm family technology.

TSMC stated that when the 3nm process technology is launched, it will be the most advanced technology in the industry in terms of PPA and transistor technology. It is confident that the 3nm family will become another large-scale and long-term demand process node for TSMC. The legal person is optimistic that TSMC's 3nm family technology is superior to its competitors in terms of yield performance and capacity scale, and can continue to dominate the advanced process market. In the next two years, it is expected to take all the wafer foundry of artificial intelligence (AI) and HPC computing. Order.

In the recently held technology forum, TSMC stated that a total of 5 3nm family technologies will be launched in the future, including N3, N3E, N3P, N3X and other processes from 2022 to 2025, and an optimized N3S process will be launched in the future. It covers four major platforms including smartphones, Internet of Things, automotive electronics, and HPC.

According to industry insiders, Apple will be the first customer to use 3nm chip production by the end of this year, and Intel will expand the use of 3nm to produce chips in processors in the second half of next year, including AMD, Huida, Qualcomm, MediaTek, Broadcom, etc. The opening of new 3nm chips will be completed next year and the year after.

Apple is a priority customer for TSMC’s advanced manufacturing process. According to equipment manufacturers and Apple’s production chain industry sources, Apple will use TSMC’s 3nm chips for the first time in the second half of the year. The first product may be the M2 Pro processor, and next year will include the new iPhone-specific A17 application processing The processor, as well as the M2 and M3 series processors, will be imported into TSMC's 3nm production.

Although Intel intends to compete for business opportunities in the foundry market, after its own processor adopts chiplet chip design, the built-in graphics chip or computing chip will be mass-produced using TSMC's 3nm process in the second half of next year. Intel's graphics processing unit (GPU), programmable logic gate array (FPGA), etc. will also use TSMC's 3nm film in the next year and the next.

In addition, although AMD lags behind Intel in the adoption of advanced processes, from the perspective of the technical blueprint, after AMD transitions to the Zen 5 architecture in the next year and the year after, some products have been determined to use TSMC's 3nm process for wafer production. As for major customers such as Huida, MediaTek, Qualcomm, and Broadcom, they will also complete the 3nm chip design and start mass production after 2024.