Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Recycle Infineon AIROC™ Wireless Connectivity:Automotive Wireless,Wi-Fi MCUs,Bluetooth Multiprotocol

Shenzhen Mingjiada Electronics Co., Ltd, as a globally renowned electronic components recycling service provider, provides customers with efficient inventory digestion solutions by virtue of its strong financial strength, professional team and global acquisition network.

Recycling process.

1、Recycling object: recycling electronic materials / sluggish materials / factory inventory / electronic inventory / personal inventory, etc..

2, recycling types: recycling all kinds of IC chips, sensors, Ethernet, IGBT modules, AI artificial intelligence, microcontroller, Internet of Things and other electronic materials.

3、Regular channel sources: the company only recycles regular channel sources, to ensure the quality of the recovered chips.

4、Recycling details: you will be backlog of IC/module inventory for simple classification, to determine the model, brand, production date, quantity and so on. You can send product details by email.

5、Testing and evaluation: The company will test the classified chips, including appearance inspection, performance test, etc. to evaluate their recycling value.

6、Recycling and trading: Based on the evaluation results, the company will negotiate with customers on specific trading methods, such as price and delivery methods.

Infineon AIROC™ Wireless Connectivity Products Overview

AIROC™ automotive wireless modules are Infineon's specialised solutions for Telematics applications, which strictly follow automotive electronics reliability standards such as AEC-Q100. These modules typically integrate Wi-Fi, Bluetooth and GNSS (Global Navigation Satellite System) functionality to support high-speed data communication between vehicle-to-infrastructure (V2I) and vehicle-to-vehicle (V2V).7 Against the backdrop of the rapid development of smart connected cars, these modules are widely used in scenarios such as in-vehicle infotainment systems, remote diagnostics, and OTA (over-the-air download) updates.

The AIROC™ Wi-Fi MCU family of products highly integrates microcontrollers with Wi-Fi functionality to form a complete system-on-chip (SoC) solution. These products support 802.11 a/b/g/n/ac/ax and other Wi-Fi standards, and some high-end models are also compatible with the latest Wi-Fi 6 (802.11ax) technology, providing higher data transfer rates and lower power consumption.

In terms of Bluetooth multi-protocol modules, Infineon's AIROC™ series offers advanced solutions supporting Bluetooth 5.0/5.1/5.2 standards. These modules not only support traditional Bluetooth data transmission, but also run both low-power Bluetooth (BLE) and classic Bluetooth protocols to meet the needs of different application scenarios. Particularly noteworthy is the dual-mode Bluetooth + WiFi combo module, which integrates two mainstream wireless technologies on a single chip, greatly simplifying product design and reducing system complexity. Such modules are widely used in wearable devices, smart home and medical electronics.