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Electric machines are widely used in modern life. Whether it is a vacuum cleaner, an air fan or an electric bicycle, these common devices in life all need motors to drive them, and a good motor driving ability is the key to ensuring the efficient and stable operation of the equipment.

Renesas Electronics brings you a high-power, compact BLDC motor control solution, which is implemented by a highly integrated three-phase smart gate driver, which can directly drive three N-channel MOSFET bridges, while the internal buck-The boost function can further reduce the number of devices, thereby providing system power.

The solution brought to you this time consists of 6 RJK0659DPA MOSFETs with low on-resistance, 1 RAA227063 smart gate driver IC and 1 RA4T1 MCU. The high-performance MCU used in the solution includes a dedicated ADC and PWM timer, allowing complex algorithms to be run while achieving smoother operation. Not only that, it also has CAN FD and I3C data communication protocols.

Introduction to main devices

The RAA227063 is a smart gate driver IC for brushless direct current (BLDC) motor applications. The RAA227063 is a smart gate driver IC for brushless direct current (BLDC) motor applications. It integrates three half-bridge smart gate drivers capable of driving up to three N-channel MOSFET bridges, supporting bridge voltages from 4.5 V to 60V. Each gate driver supports up to 1A pull current and 2A sink current drive current, and has programmable drive strength control. Adjustable and adaptive dead times are implemented to ensure robustness and flexibility. The active gate holding mechanism prevents cross-conduction caused by the Miller effect, further enhancing robustness.

The RJK0659DPA is a MOSFET suitable for switching (motor drives, etc.) and load switching applications with low on-resistance, high speed switching and high robustness.

Based on a 100 MHz Arm ® Cortex ®-M33 core with TrustZone ®, the RA4T1 offers optimized peripherals for motor control and inverter control functions with small 32-pin QFN and LQFP packaging options that meet the needs of high-performance, cost-sensitive and space-constrained applications. In addition, it integrates a variety of communication interfaces, including CAN FD, I3C, SCI and SPI, to meet all connectivity needs for various motor control and consumer applications.