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With the continuous development of China's digital environment, the demand for high-speed and high-performance connectivity solutions in various industries is accelerating. As a global leader in electronic products and innovator in connectivity technology, Molex showcased its latest solutions for AI driven data centers and advanced connectivity technologies for next-generation mobile devices and smart home appliances at the just concluded 2025 Munich Shanghai Electronics Show (electronica China).

Roc Yang, Vice President of Sales for Molex China, stated, "Molex is committed to meeting the constantly evolving Chinese market. Our solutions enable faster data transmission, higher energy efficiency, and seamless connectivity, meeting today's most demanding application requirements. ”

Building the Next Generation of Ultra Large Scale Data Centers

The world is becoming increasingly interconnected, driving the growth of data generation and consumption. The core of this interconnectivity transformation is the constantly developing super large scale data center network. These large-scale data centers prioritize density, scalability, and modularity to meet the bandwidth intensive application demands brought by the Internet of Things (IoT), streaming media, artificial intelligence (AI), machine learning, 1.6T networks, and other high-speed applications. With China's increasing demand for data processing and AI driven applications, the market's demand for these high-performance, scalable data centers is also unprecedentedly high.

Yang continued, "As the amount of data processed by China's ultra large scale data centers continues to grow, optimizing computing power within limited space has become a major goal. By utilizing connector solutions designed and optimized for space and flexibility, ultra large scale system architects can achieve higher server density and better performance.

Molex's solutions in this field include: designing Mirror Mezz connectors to provide excellent signal integrity at different stacking heights; The NearStack PCIe connector system eliminates paddle cards to reduce space requirements; Kickstart connector system that integrates power and signal circuits into a single flat cable assembly. In addition, the NextStream connector system supports PCIe Gen 6 speed in a compact package with low to high specifications.

Optimize the design of mobile devices and smart home appliances for China

In addition, Molex also showcased a range of high-performance connectivity solutions at the conference, aimed at meeting the evolving needs of major industries in China, such as consumer electronics, automotive, industrial automation, and medical technology. The exhibited products include:

Pico Clasp Connector - Molex's core 1.00mm pitch, wire to board Pico Clasp connector is a multifunctional system that offers a variety of plating and design options, with circuit numbers ranging from 2 to 50, and offers a wide pin socket type, making it an ideal choice for space constrained applications. Multiple design options, including gold and tin plating, make the design more flexible and keep the product line simple.

Micro Lock Plus - The Micro Lock Plus 1.25mm pitch connector system is an ideal choice for compact applications, with electrical and mechanical reliability, design flexibility, and safe mating retention to overcome various challenges in high-temperature design (up to 105 ° C). Visitors can learn how the compact size, wide positive latch, and secure mating retention of Micro Lock Plus wire to wire and wire to board connectors reduce assembly errors while helping to avoid common issues in high-temperature environments.