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Shanghai, China, April 24, 2025 - ROHM, a globally renowned semiconductor manufacturer headquartered in Kyoto, Japan, today announced the launch of the 4in1 and 6in1 structure SiC plastic-encapsulated module "HSDIP20". This series of products is highly suitable for applications such as PFC and LLC converters of xEV (Electric Vehicle) on-board chargers (hereinafter referred to as "OBC"). The product lineup of HSDIP20 includes six models with a 750V withstand voltage (BSTxxx1P4K01) and seven models with a 1200V withstand voltage (BSTxxx2P4K01). By integrating the basic circuits required in various high-power application circuits into small module packages, the design time for customers can be effectively reduced, and it is also conducive to the miniaturization of power conversion circuits in applications such as OBC.

The HSDIP20 is equipped with an insulating substrate with excellent heat dissipation performance, which can effectively suppress the temperature rise of the chip even when operating at high power. In fact, in the commonly used PFC circuit of OBC (using 6 SiC MOSFETs), after comparing the HSDIP20 module with a 6-in-1 structure using 6 top-cooled discrete devices under the same conditions, it was found that the temperature of the HSDIP20 was approximately 38 ° C lower than that of the vertical structure (when operating at 25W). This excellent heat dissipation performance enables the product to handle high current demands with a very small package. In addition, compared with the top-cooled discrete devices, the current density of HSDIP20 reaches more than three times. Compared with the DIP modules of the same type, the current density is as high as more than 1.4 times, reaching the advanced level in the industry. Therefore, in the above-mentioned PFC circuit, the installation area of HSDIP20 can be reduced by approximately 52% compared to the top-cooled discrete devices, which is highly conducive to the miniaturization of power conversion circuits in applications such as OBC.

The new product has been temporarily put into mass production at a scale of 100,000 units per month since April 2025 (the sample price is 15,000 yen each, excluding tax). The production bases of the previous process are ROHM Apollo CO., LTD. (Chikugo Factory, Fukuoka Prefecture, Japan) and the Miyazaki Factory of Blueshi Semiconductor (Nishizaki Prefecture), and the production base of the subsequent process is ROHM Integrated Systems (Thailand) Co., Ltd. (Thailand).

"Product Lineup"

< Application Example >

Power conversion circuits such as PFC and LLC converters are also widely used in the primary side circuits of industrial equipment. Therefore, HSDIP20 can also provide support for the miniaturization of application products in fields such as industrial equipment and consumer electronics.

Vehicle-mounted equipment

On-board charger (OBC), DC-DC converter, electric compressor, etc

Industrial equipment

EV charging piles, V2X systems, AC servers, server power supplies, PV inverters, power regulators, etc

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